Cyclone® IV EP4CE15 FPGA
Specifications
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Essentials
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Product Collection
Cyclone® IV E FPGA
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Marketing Status
Launched
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Launch Date
2009
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Lithography
60 nm
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Resources
I/O Specifications
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Maximum User I/O Count†
343
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I/O Standards Support
3.0 V to 3.3 V LVTTL, 1.2 V to 3.3 V LVCMOS, PCI, PCI-X, SSTL, HSTL, Differential SSTL, Differential HSTL, LVDS, Mini-LVDS, RSDS, LVPECL, BLVDS, PPDS
Advanced Technologies
Package Specifications
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Package Options
E144, M164, M256, U256, F256, F484
Supplemental Information
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Additional Information
Product Table (Family Comparison)
Cyclone IV Featured Documentation
All FPGA Documentation
Ordering and Compliance
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Ordering and spec information
Trade compliance information
- ECCN Varies By Product
- CCATS NA
- US HTS 8542390001
PCN Information
SR63S
- 967293 PCN
SR8HE
- 970204 PCN
SR8HK
- 970209 PCN
SR63W
- 967297 PCN
SR8HJ
- 970208 PCN
SR63V
- 967296 PCN
SR63U
- 967295 PCN
SR8HH
- 970207 PCN
SR5W9
- 967026 PCN
SR63T
- 967294 PCN
SR8HG
- 970206 PCN
SRAGL
- 971889 PCN
SRAGK
- 971888 PCN
SRAGJ
- 971887 PCN
SRB4V
- 973185 PCN
SRB4U
- 973184 PCN
SRB4R
- 973181 PCN
SR9CW
- 971153 PCN
SR9CV
- 971152 PCN
SRAMB
- 972514 PCN
SRAMA
- 972513 PCN
SRCGB
- 974412 PCN
SRCGA
- 974411 PCN
SRAMC
- 972515 PCN
SR5WD
- 967030 PCN
SR5WC
- 967029 PCN
SR5WB
- 967028 PCN
SR5WA
- 967027 PCN
Drivers and Software
Description
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Latest Drivers & Software
Launch Date
The date the product was first introduced.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Logic Elements (LE)
Logic elements (LEs) are the smallest units of logic in Intel® FPGA architecture. LEs are compact and provide advanced features with efficient logic usage.
Fabric and I/O Phase-Locked Loops (PLLs)
Fabric and IO PLLs are used to simplify the design and implementation of the clock networks in the Intel FPGA fabric, and also the clock networks associated with the IO cells in the device.
Maximum Embedded Memory
The total capacity of all the embedded memory blocks in the programmable fabric of the Intel FPGA device.
Digital Signal Processing (DSP) Blocks
The digital signal processing (DSP) block is the mathematical building block in supported Intel FPGA devices and contains high-performance multipliers and accumulators to implement a variety of digital signal processing functions.
Digital Signal Processing (DSP) Format
Depending on the Intel FPGA device family, the DSP block supports different formats such as hard floating point, hard fixed point, multiply and accumulate, and multiply only.
Hard Memory Controllers
Hard memory controllers are used to enable high-performance external memory systems attached to the Intel FPGA. A hard memory controller saves power and FPGA resources compared to the equivalent soft memory controller, and supports higher frequency operation.
External Memory Interfaces (EMIF)
The external memory interface protocols supported by the Intel FPGA device.
Maximum User I/O Count†
The maximum number of general purpose I/O pins in the Intel FPGA device, in the largest available package.
† Actual count could be lower depending on package.
I/O Standards Support
The general purpose I/O interface standards supported by the Intel FPGA device.
FPGA Bitstream Security
Depending on the Intel FPGA device family, various security features are available to prevent copying of the customer bitstream, and detect attempts to tamper with the device during operation.
Analog-to-Digital Converter
The analog-to-digital converter is a data-converter resource available in some Intel FPGA device families.
Package Options
Intel FPGA devices are available in different package sizes, with different IO and transceiver counts, to match customer system requirements.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.