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  • Brand Name: Core Ultra

  • Product Number: 6526Y

  • Ordering Code: PK8072205559500

  • SPEC Code: SRN6N

  • Code Name: Emerald Rapids

Intel® Server System S9232WK1HAC Compute Module

Specifications

Export specifications

Essentials

Supplemental Information

  • Embedded Options Available No
  • Description S9200WK Compute Module for use in Intel® Data Center Blocks featuring Intel® Xeon®
    Platinum 9200 processors housed in new 2U front I/O Intel® Server Chassis FC2000.

Expansion Options

Package Specifications

  • Max CPU Configuration 2

Ordering and Compliance

Retired and discontinued

Intel® Server System S9232WK1HAC Compute Module, Single

Trade compliance information

  • ECCN 5A002U
  • CCATS G157815L1
  • US HTS 8471500150

PCN Information

Compatible Products

2nd Gen Intel® Xeon® Scalable Processors

Product Name Launch Date Total Cores Max Turbo Frequency Processor Base Frequency Cache TDP Sort Order Compare
All | None
Intel® Xeon® Platinum 9221 Processor Q3'19 32 3.70 GHz 2.30 GHz 71.5 MB 250 W 483

6th Generation Intel® Core™ i7 Processors

Product Name Launch Date Total Cores Max Turbo Frequency Cache GPU Name‡ Sort Order Compare
All | None
Intel® Core™ i7-6498DU Processor Q4'15 2 3.10 GHz 4 MB Intel® Smart Cache Intel® HD Graphics 510 9201

Intel® Server Chassis FC2000 Family

Product Name Marketing Status Chassis Form Factor Sort Order Compare
All | None
Intel® Server Chassis FC2HAC21W3 Discontinued 2U Front IO, 4 node Rack 62667

Management Module Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
EMP Module AXXFCEMP Q3'19 Launched 64465
Remote Management Module 4 Lite 2 AXXRMM4LITE2 Q2'16 Launched 64474

Rail Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
1U Internal Rail Kit for Chassis (FC2000 Family) FCXX1USPPRT Q3'19 Launched 64566

Spare Cable Options

Compare
All | None

Spare Chassis Maintenance Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
1U Compute Module Blank Node Filler AXXFC1UBLANK Q3'19 Launched 64975

Spare Heat-Sink Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
M.2 Heat sink Assembly FXXWKM2HS Q3'19 Discontinued 65270

Spare Riser Card Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
1U Spare PCIe Riser (x16 PCIe slot and M.2 Connector) FXXWK1URISER Q3'19 Discontinued 65406

Intel® Server Component Extended Warranty

Product Name Launch Date Marketing Status Sort Order Compare
All | None
Dual Processor Board Extended Warranty Q2'11 Discontinued 65454

Intel® Ethernet Network Adapter XXV710

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All | None

Intel® Ethernet Server Adapter XL710

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All | None

Intel® Ethernet Network Adapter X710

Product Name Embedded Options Available Cabling Type Port Configuration Data Rate Per Port System Interface Type Sort Order Compare
All | None
Intel® Ethernet Converged Network Adapter X710-DA2 No SFP+ Direct Attached Twinaxial Cabling up to 10m Dual 10/1GbE PCIe 3.0 (8.0 GT/s) 52274

Intel® Ethernet Converged Network Adapter X550

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All | None

Intel® Optane™ DC SSD Series

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All | None

Drivers and Software

Latest Drivers & Software

Downloads Available:
All

Name

Server Configuration Utility (syscfg) for Intel® Server Boards and Intel® Server Systems

View Details

Intel® Server Debug and Provisioning Tool (Intel® SDP Tool) for Linux*

View Details

Intel® Configuration Detector for Linux*

View Details

BMC Source Code for Intel® Server Boards and Systems Based on Intel® 62X Chipset

View Details
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Support

Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

Integrated BMC with IPMI

IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Embedded Options Available

“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Types

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

Max # of Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Intel® Optane™ Persistent Memory Supported

Intel® Optane™ persistent memory is a revolutionary tier of non-volatile memory that sits between memory and storage to provide large, affordable memory capacity that is comparable to DRAM performance.  Delivering large system-level memory capacity when combined with traditional DRAM, Intel Optane persistent memory is helping transform critical memory constrained workloads – from cloud, databases, in-memory analytics, virtualization, and content delivery networks.

PCIe x16 Gen 3

PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).

Intel® Optane™ Memory Supported ‡

Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration. Visit www.intel.com/OptaneMemory for configuration requirements.

TPM Version

TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.

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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.