Intel's next-generation of FPGAs will use Intel's own 10-nanometer (10nm) chip-manufacturing process technology - an advanced FinFET process. Known today by the codename “Falcon Mesa,” these FPGAs products will target the acceleration and compute needs in data center, wireless 5G, Network Function Virtualization (NFV), automotive, industrial, and military/aerospace applications.
New Levels of Performance Using Intel’s Advanced 10nm FinFET Process
Falcon Mesa 10nm FPGAs will continue Intel® FPGAs transceiver technology innovation and leadership.
112 Gbps serial transceiver links to support the most demanding bandwidth requirements in next-generation data center, enterprise, and networking environments.
Latest peripheral device interconnect including PCI Express* Gen4 x16 support with data rates up to 16 GT/s per lane for next-generation data centers.
The new FPGAs family will also build upon several innovative technologies from the current Intel® Stratix® 10 14nm FPGA family.
Intel’s next-generation Embedded Multi-Die Interconnect Bridge (EMIB) packaging technology for continued leadership in hetergeneous 3D system-in-package (SiP) integration. The second generation will be optimized for higher levels of transceiver performance alongside a monolithic FPGA fabric.
Next-generation high bandwidth memory (HBM) support, a DRAM memory architecture that delivers 10x the performance of discrete memory solutions in a smaller form factor with lower power consumption.
Next-generation of Intel® Hyperflex™ FPGA Architecture - which uses registers, called hyper-registers, throughout the FPGA, optimized for leading performance on 10nm. The second generation of Intel® Hyperflex™ FPGA Architecture, combined with Intel® Quartus® Prime & High Level Design tools, will deliver the highest in performance and productivity required for next-generation systems.
For more information contact your local Intel Programmable Solutions Group sales representative.