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Universal 3D Standard
Interactive 3D graphics are a powerful medium for the communication of ideas, the education of people and as a source of entertainment. However, while digital audio, video, and photos are exchanged easily via the Internet and across computing applications, technical barriers have prevented similar widespread use of interactive 3D content.

Bandwidth and computing performance have increased dramatically in recent years, opening opportunities for new communications media. However, the lack of standards for experiencing and sharing 3D content has limited its potential uses beyond the engineering community.

Widespread use of 3D technologies offers the promise of enriched media that revolutionizes how complex data sets are communicated. For example:

By repurposing product designs, companies could have powerful, cost-effective, easy-to-develop training tools based on interactive simulation.
Electronic owner's manuals could provide interactive guides for maintaining and repairing products throughout their life cycles.
Online catalog customers could test products by interacting with the 3D models created during product development.

Intel has taken a leading role in creating an open and extensible format, called Universal 3D, for the sharing and visualization of 3D data in nonengineering applications. This standard format—a "JPEG" for 3D graphics—along with Intel's sample software implementation are designed to support the repurposing of existing 3D CAD data for use in other applications.

The new standard was developed in close collaboration with Ecma International, an industry standards group, and the 3D Industry Forum (3DIF). In December 2004, Ecma International officially adopted U3D as an open international specification referred to as standard ECMA-363 Universal 3D File Format.

The 3D Industry Forum
Intel, along with other 3D industry organizations, has established a forum to develop a standard file format and sample runtime libraries designed to support the efficient reuse of 3D data in mainstream applications. The 3D Industry Forum emerged from meetings Intel conducted both with end users of 3D data, as well as leading 3D graphics hardware and software developers. The meetings explored the potential benefits and implications of establishing a common standard for sharing 3D content over the Internet, as well as in mainstream business applications.

Today, the 3D Industry Forum (3DIF) has more than 30 members. Its goals include:

Creation of a common standard, in cooperation with Ecma International, for sharing lightweight 3D content with high visual quality.
Providing the tools and information necessary for adoption and integration of the Universal 3D standard file format.
Promotion of industry growth and ecosystem development for the 3D graphics market.
Education of business and end-user communities as to the value and benefits of 3D usage models.
Coordination of efforts with other organizations that support similar and/or complementary initiatives.
Source 3D data provided by and used with permission of
The Boeing Company
Learn More

Discover more about Universal 3D (U3D) by exploring the links below.   (All .pdfs on this page are in Adobe Acrobat* file format.)

White Papers
Universal 3D [PDF 180KB]
The Impact of U3D on Product Lifecycle Management (PLM) [PDF 6MB]
Project Brief
The Universal 3D (U3D) Research Project [PDF 241KB]
Press Releases
Bentley Adds 3D PDF Generation to MicroStation, Bentley Systems press release
Universal 3D Format Gains Momentum as Adobe* Announces Support in Acrobat* 7.0 Software, Intel press release
Industry Organizations
3D Industry Forum (3DIF)
Ecma International
All information provided related to future Intel products and plans is preliminary and subject to change at any time, without notice.
Related Links
Product Technologies
Systems Technology Lab
Low Power on Intel® Architecture
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