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REFERENCES

[1]	B. Sankman and M. Tay, "FCPGA Technology Target Specification," Intel internal document (1998).
[2]	Jim Irvine and J. Dunham, "FCPGA Package-B1 Design Requirements Document," Intel internal document (1999).
[3]	Jim Irvine and J. Dunham, "FCPGA Package-B2 Design Requirements Document," Intel internal document (1999).
[4]	Tim Takeuchi, A. Waizman, A. Hasan and C. Baldwin, "FCPGA Package-C Design Requirements Document," Intel internal document (1999).
[5]	C. Baldwin, "FCPGA Package-A Design Requirements Document," Intel internal document (1999).
[6]	Rao Tummala and Eugene Rymaszewski, "Microelectronics Packaging Handbook", (1988).
[7]	Y. Guo, Y. Sha, C. Jayaram, and V. Wakharkar, "Low Cost Underfill Materials for Flip Chip Packages," Intel Manufacturing for Excellence Conference (IMEC), 2000.