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Intel Technology JournalPast Journals 2005
The eight most recent issues are available in both HTML and PDF formats. Earlier issues are in PDF format only.
Q4
Vol. 9 Issue 4 (November 2005) Electronic Package Technology Development
- Complete Vol. 9 Issue 4 (PDF 8.87MB)
- Preface (HTML) (PDF unavailable)
- Foreword – Challenges and Opportunities in Electronic Package Technology Development (HTML) (PDF unavailable)
- Advanced Package Technologies for High-Performance Systems (PDF 1.55MB)
- Power Delivery for High-Performance Microprocessors (PDF 2.1MB)
- Nano and Micro Technology-Based Next-Generation Package-Level Cooling Solutions (PDF 427KB)
- Finding Solutions to the Challenges in Package Interconnect Reliability (PDF 584KB)
- Materials Technologies for Thermomechanical Management of Organic Packages (PDF 1.10MB)
- Pentium® 4 Processor High-Volume Land-Grid-Array Technology: Challenges and Future Trends (PDF 1.78MB)
- Advanced Fault Isolation and Failure Analysis Techniques for Future Package Technologies (PDF 1.13MB)
- Future Package Technologies for Wireless Communication Systems (PDF 800KB)
Q3
Vol. 9 Issue 3 (August 2005) Managing International Supply and Demand at Intel
- Complete Vol. 9 Issue 3 (PDF 3.08MB)
- Preface (HTML) (PDF unavailable)
- Foreword – Managing Intels International Network of Supply and Demand (HTML) (PDF unavailable)
- Managing Uncertainty in Planning and Forecasting (PDF 160KB)
- Using Capacity Options to Better Enable Our Factory Ramps (PDF 245KB)
- Redefining the Test Equipment Supply Chain: The Open Architecture Revolution (PDF 264KB)
- e-Procurement – Strengthening the Indirect Supply-Chain Through Technology Globalization (PDF 327KB)
- Intels Processes for Capacity Planning Optimization (PDF 224KB)
- Optimizing Supply-Chain Planning (PDF 229KB)
- Inventory Modeling (PDF 192KB)
- RosettaNet for Intels Trading Entity Automation (PDF 420KB)
- RFID: The Real and Integrated Story (PDF 296KB)
Q2
Vol. 9 Issue 2 (May 2005) Compute-Intensive, Highly Parallel Applications and Uses
- Complete Vol. 9 Issue 2 (PDF 1.96MB)
- Preface (HTML) (PDF unavailable)
- Foreword – Recognition, Mining and Synthesis (HTML) (PDF unavailable)
- Ray Tracing Goes Mainstream (PDF 261KB)
- Computer Vision Workload Analysis: Case Study of Video Surveillance Systems (PDF 356KB)
- Learning-Based Computer Vision with Intels Open Source Computer Vision Library (PDF 461KB)
- Performance Scalability of Data-Mining Workloads in Bioinformatics (PDF 223KB)
- Performance and Scalability Analysis of Tree-Based Models in Large-Scale Data-Mining Problems (PDF 469KB)
- Parallel Computing for Large-Scale Optimization Problems: Challenges and Solutions (PDF 206KB)
- Understanding the Platform Requirements of Emerging Enterprise Solutions (PDF 163KB)
Q1
Vol. 9 Issue 1 (February 2005) Second-Generation Intel Centrino Mobile Technology
- Complete Vol. 9 Issue 1 (PDF 3.5MB)
- Preface (HTML) (PDF unavailable)
- Introduction Second-Generation Intel Centrino Mobile Technology Platform (PDF 728KB)
- Intel® 915GMS Chipset: In Mobile Platforms, Smaller is Better (PDF 1.0MB)
- The Emergence of PCI Express* in the Next Generation of Mobile Platforms (PDF 353KB)
- High-Performance Graphics and TV Output Comes to the Second-Generation Intel® Centrino™ Mobile Technology Platform (PDF 287KB)
- Low-Power Audio and Storage Input/Output Technologies for the Second-Generation Intel® Centrino™ Mobile Technology Platform (PDF 304KB)
- Performance and Power Consumption for Mobile Platform Components Under Common Usage Models (PDF 399KB)
- Interface Material Selection and a Thermal Management Technique in Second-Generation Platforms Built on Intel® Centrino™ Mobile Technology (PDF 405KB)
- Next-Generation PC Platform Built on Intel® Centrino™ Mobile Technology New Usage Models (PDF 463KB)