Technology & Research

Intel® Technology Journal Home

Volume 12, Issue 02

Intel's 45nm CMOS Technology

• Table of Contents
• Technical Reviewers
• About This Journal
• Intel Published Articles
• Read Past Journals
• Subscribe/Unsubscribe
• RSS Feed
• E-Mail this Journal to a Colleague

ISSN 1535-864X DOI 10.1535/itj.1202.07

• Volume 12
• Issue 02
• Published June 17, 2008

• Home›
• Technology and Research›
• Intel Technology Journal›
• Intel's 45nm CMOS Technology

Intel's 45nm CMOS Technology

  Section 8 of 10  

Flip-Chip Packaging Technology for Enabling 45nm Products

ACKNOWLEDGMENTS

We acknowledge the materials, process and platform teams that supported the 45nm packaging technology and small form-factor packaging.

  Section 8 of 10  

In this article

• Abstract
• Introduction
• First-Level Lead-Free Interconnect
• Form-Factor Management
• Package Size Reduction in XY
• Z-Height Reduction
• Conclusion
• Acknowledgments
• References
• Authors' Biographies