Intel's 45nm CMOS Technology

Flip-Chip Packaging Technology for Enabling 45nm Products

CONCLUSION

A series of iterative optimizations of design, fab, assembly materials, and process led to a high-yielding, 100% Pb-free, 45nm packaging process. The on-time and on-target delivery of this technology led to Intel's continued one-generation-ahead lead in the 45nm product, underlining Intel's assurance that it will develop a new process technology with enhanced microarchitecture or an entirely new microarchitecture every year. The elimination of lead in this technology also makes Intel the leader in achieving environmentally green products

In this paper we shared some of the key challenges associated with the development of a high-volume manufacturing compatible assembly process for packaging Intel's 45nm, completely Pb-free devices. Key technical challenges were addressed through development of novel FLI solders, fluxing material, and process solutions. In addition, stress transfer to silicon and its impact to low-k ILD integrity were reduced, by the use of novel interconnect designs. Small form-factor packaging challenges were overcome by a series of innovative materials and process changes to achieve a reduction in form factor while meeting the technology reliability goals. This enables Intel's continuing leadership in thin and light notebooks and smart phone devices.

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