Technology with the Environment in Mind

Making USB a More Energy-Efficient Interconnect

AUTHORS’ BIOGRAPHIES

Barnes Cooper
Barnes Cooper is a Principal Engineer within the Intel Mobile Platforms Group (MPG) and has been working on mobile platform architecture and power/thermal management since 1992. He was a key contributor to numerous power/thermal innovations such as ACPI 1.0, Enhanced Intel SpeedStep® technology, and multi-core/thread power management. He works extensively with Microsoft engineers on defining OS power management innovations. His e-mail is barnes.cooper at intel.com.

Paul Diefenbaugh
Paul Diefenbaugh is an architect within the Intel Corporate Technology Group (CTG) leading efforts there on Platform Power Management. He holds an M.S. degree in Computer Science from Oregon Graduate Institute. Paul joined Intel in 1992 and has focused on mobile platforms and energy efficiency during the last ten years. He was a key contributor to the ACPI 2.0 specification, the Linux implementation of ACPI and OSPM, and various Intel power-management innovations addressing processors, interconnects, displays, storage, and platforms. His e-mail is paul.s.diefenbaugh at intel.com.

Jim Kardach
Jim Kardach is a Senior Principal Engineer within the Intel Mobile Product's Group (MPG). He joined Intel in 1986 where for the last 20 years he has worked on notebook processors and chipsets. Jim worked on developing technologies for the notebook platform (including the original ACPI specification). Jim has about 50 issued patents, was runner-up in the 1996 Discover Magazine's Innovation Award, and was one of the original inductees into the Bluetooth Hall of Fame for his work on that standard. His e-mail is jim.kardach at intel.com.

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