Technology with the Environment in Mind

Materials Technology for Environmentally Green Micro-electronic Packaging

REFERENCES

[1] Daewoong Suh et al., "Effects of Ag content on fracture resistance of Sn-Ag-Cu lead-free solders under high strain rate conditions," Materials Science and Engineering A, 46-461, 2008, pps. 595–603.

[2] Vasu Vasudevan et al., "Slow Cycle Fatigue Creep Performance of Pb-free (LF) Solders," ECTC, 2008.

[3] Irina Boguslavsky et al., "Recrystallization Principles Applied to Whisker Growth in Tin", APEX Conference, March 31, 2003, Anaheim, CA, pps. 1–14.

[4] R. Mahajan et al., "Advances and Challenges in Flip-Chip Packaging," IEEE 2006 Custom Integrated Circuits Conference, (CICC), 2006.

[5] V. Wakharkar et al., "Microelectronic Packaging Materials Development & Integration Challenges for Lead Free," TMS Conference, 2006.

[6] Carl Deppisch et al., "Material Optimization and Reliability Characterization of Indium Solder Thermal Interface Materials for 1262 Package technology," IATTJ Journal, Vol. 5, 2002, pps. 227–240.

[7] Smithell's Metals Reference Book, E. A. Brandes and G.B. Brook (editors), Seventh edition, 1992, Butterworth Heineman, London, England.

[8] JEDEC J-STD-020.

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