Technology with the Environment in Mind

  Section 8 of 10  

Materials Technology for Environmentally Green Micro-electronic Packaging

ACKNOWLEDGMENTS

This work would not have been possible without the support of several people within Intel, specifically in ATD pathfinding and development, and in assembly materials, modules, quality and reliability (Q&R).

For the HF work, the authors specifically thank Derek Hetherington and Yi He in the AMCL chemical lab for substrate halogen content evaluations. The authors also thank Raiyo Aspandiar for his contribution to the surface-mount challenges section for 2LI.

  Section 8 of 10  

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