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Volume 11, Issue 03

Tera-scale Computing


Intel Technology Journal - Featuring Intel's recent research and development

ISSN 1535-864X DOI 10.1535/itj.1103.01

  • Volume 11
  • Issue 03
  • Published August 22, 2007

Tera-scale Computing

  Section 7 of 10  

Integration Challenges and Tradeoffs for Tera-scale Architectures

SUMMARY

Tera-scale architecture presents tremendous challenges and opportunities to take advantage of Moore's Law. As discussed in this paper, the architectural and design tradeoffs for tera-scale architecture are unique to this architecture. A very high level of integration and the presence of heterogeneous building blocks necessitate a modular and scalable on-chip interconnect. Based on the organization, architectural building blocks, and physical design constraints, we expect ring, 2D-mesh, or similar topologies to be an attractive option. Interconnects with switches, such as 2D-mesh, though better in utilizing wiring tracks, bring their own challenges in terms of achieving aggressive latency targets within an acceptable power budget.

With shrinking device geometries and resulting increases in process variability and device failure rates, careful consideration needs to be given to get maximum performance without excessive cost through overly conservative designs. A flexible on-chip interconnect can play a role in dealing with variability and in-field failures by adapting to an optimal operating configuration through provisioning for fault-tolerant routing. A flexible interconnect can also be used to provide additional functionality, such as improved quality of service and performance isolation, to make tera-scale architectures more useful.

Providing adequate memory and I/O bandwidth to satisfy the needs of large numbers of compute engines in tera-scale architecture is a major challenge. Some of these can be addressed through using on-chip caches more effectively such that the needs of off- chip memory bandwidth are reduced. A higher integration of system components on tera-scale architecture also reduces pressure on memory bandwidth by avoiding the need for I/O controllers and compute engines to exchange data through the caches rather than memory. Technological approaches to improve the available memory bandwidth are also an active area of exploration, ranging from 3D stacked memory to higher speed memory interfaces, but they do have their own challenges, such as limited memory capacity and higher power consumptions, respectively.

In conclusion, tera-scale architecture is definitely in the not-too-distant future of mainstream computer architecture. Its realization, however, poses some challenges and a rich set of problems for researchers both in academia and industry. Problems and some solution strategies related to the "uncore" have been presented in this paper.

  Section 7 of 10  

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