The Intel® Core™ Duo processor is the first microprocessor to use Intel’s groundbreaking 65-nanometer semiconductor process, the first to have dual core on die and the first Intel® processor to be used by Apple Macintosh* computers. The Intel® Core™ Duo processor balances dual-core computing capabilities with power savings that enable improved battery life in notebooks. Its major performance boost is achieved by integrating dual cores on the die using Chip Multi-Processing (CMP) architecture.

At Apple’s annual shareholders meeting in April 2006, CEO Steve Jobs stated, "Intel has a great roadmap. This new [Intel® Core™ Duo] chip is phenomenal–it blows away anything other suppliers have, including our former suppliers." Jobs described the company’s upcoming products as "the best I’ve ever seen in my life." Intel’s processor is an important part of Apple Computer’s exciting upcoming products.

This issue of Intel® Technology Journal (Volume 10, Issue 2) reviews the Intel® Core™ Duo processor’s architecture design, system, power, thermal and wireless features. It examines in detail the design considerations used in the Intel® Core™ Duo processor to achieve a balance between improving performance and saving watts.

The seven technical papers include an overview paper describing the key objectives for Intel® Core™ Duo processor architecture. The Core Duo processor is the first mobile processor to implement Chip Multi-Processing (CMP), also known as dual core on die. Its major performance boost is achieved by integrating the cores on the die. This paper asserts that continuing single-thread performance is costly in terms of power and may achieve diminishing returns in terms of efficiency. It explores the potential for greatly improved performance through parallelism between threads running on the two cores.

System, power and thermal topics are reviewed in the next four papers. The second paper examines the design considerations used in the Intel® Core™ Duo processor. It provides recommendations on how to optimize software code developed for the Intel® Core™ Duo processor so that future applications can take full advantage of the new design. The third paper discusses the power control unit and its impact on the power-saving mechanisms, and describes the distribution of P-states and other techniques used to improve the system power consumption including the impact of multi-threading on power consumption. The fourth paper looks at specific form-factor requirements for the mobile "thin and light" platform and limitations for the kinds of cooling solutions these platforms can have. With increased memory speeds and capacities, we are now reaching the point where the memory thermals are starting to exceed the cooling capabilities of mobile systems. This paper discusses memory throttling techniques implemented in platforms built on Intel® Centrino® Duo processor technology. The fifth paper describes the power management features of the Intel® 945GMS Express Chipset Graphics and Memory Controller Hub (GMCH), the Intel® 82801GBM/GHM I/O Controller Hub (ICH), and the overall platform features.

The last two papers focus on wireless technologies. The sixth reviews the work and design approach in the development of the Intel® PRO/Wireless 3945ABG Network Connection card for the Intel® Centrino® Duo processor technology platform. The seventh paper addresses one of the key ingredients for current and future versions of Intel® Centrino® processor technology, which is the ability to provide users with fast and low-power communications. This is achieved by using multiple-input multiple-output (MIMO) architecture for the design of a superior wireless communication system with respect to reliability, throughput, and power consumption.

After reading these papers, we hope you agree Intel’s Core™ Duo processor is phenomenal!