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Volume 10, Issue 02
Intel® Centrino® Duo Processor Technology
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Intel® Centrino® Duo Mobile Technology
Intel® Technology Journal
Featuring Intel's recent
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Intel® Centrino® Duo Mobile Technology
Volume 10    Issue 02    Published May 15, 2006
ISSN 1535-864X    DOI: 10.1535/itj.1002
Foreword
Intel® Centrino® Duo mobile technology: The beginning of an era of mobile multi-core computing
By Dadi Perlmutter
Senior Vice President, General Manager, Mobility Group
Current articles
Introduction
Introduction to Intel® Core™ Duo processor architecture
Learn about the challenges of building a general-purpose mobile core that provides the highest level of performance while enabling the system to fit into different thermal envelopes.
System, power and thermals
CMP implementation in systems based on the Intel® Core™ Duo processor
Take a closer look at the first mobile core to implement Core Multi-Processor (CMP) technology on one die, thus maximizing performance and minimizing power consumption.
Power and thermal management in the Intel® Core™ Duo processor
Read how power and thermal control methods have become a driving factor in the architecture and design process of platforms based on the Intel® Core™ Duo processor.
System memory power and thermal management in platforms built on Intel® Centrino® Duo mobile technology
Examine techniques that greatly improve the memory power/thermal management in thin and light platforms built on Intel® Centrino® Duo mobile technology.
Intel® 945GMS Express Chipset for small form factor platform based on Intel® Centrino® Duo mobile technology
Gain insight into the challenges of designing better notebooks with shrinking package sizes and growing interface speeds.
Wireless communications
WLAN system, HW, and RFIC architecture for the Intel® PRO/Wireless 3945ABG network connection
Learn about Intel’s different architectural and functional design approaches to improve time to market, size, and cost of our WLAN products.
MIMO architecture for wireless communication
Consider the use of multiple-input multiple-output (MIMO) architecture for the design of a superior wireless communication system with respect to reliability, throughput, and power consumption.

Preface
Lin Chao
Publisher
Intel® Technology Journal

The Intel® Core™ Duo processor is the first microprocessor to use Intel’s groundbreaking 65-nanometer semiconductor process, the first to have dual core on die and the first Intel® processor to be used by Apple Macintosh* computers. The Intel® Core™ Duo processor balances dual-core computing capabilities with power savings that enable improved battery life in notebooks. Its major performance boost is achieved by integrating dual cores on the die using Chip Multi-Processing (CMP) architecture.

At Apple’s annual shareholders meeting in April 2006, CEO Steve Jobs stated, "Intel has a great roadmap. This new [Intel® Core™ Duo] chip is phenomenal–it blows away anything other suppliers have, including our former suppliers." Jobs described the company’s upcoming products as "the best I’ve ever seen in my life." Intel’s processor is an important part of Apple Computer’s exciting upcoming products.

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