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Intel® Centrino® Duo Processor Technology
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Intel® Centrino® Duo Mobile Technology
Intel® Technology Journal
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Intel® Centrino® Duo Mobile Technology
Volume 10    Issue 02    Published May 15, 2006
ISSN 1535-864X    DOI: 10.1535/itj.1002.06

  Section 9 of 9  
WLAN System, HW, and RFIC Architecture for the Intel® PRO/Wireless 3945ABG Network Connection
Authors’ biographies


Mark Ruberto
Mark Ruberto received his Ph.D. degree in Electrical Engineering from Columbia University in New York in 1991. He worked as a postdoctoral research scientist at the Technion in Haifa in the area of microwave optoelectronics. After 10 years as an RF and Microwave design engineer in various Israeli companies, he joined Intel in 2003 as a senior RFIC design engineer. Mark designs RF CMOS circuits for Intel’s wireless products. He has also led projects in the RF model/collateral development for an Intel® RF process, and in the integration of an RF reliability validation flow into the design of Intel’s CMOS radio chips. Mark authored over 30 technical papers, holds one patent, and is a Senior Member of the IEEE. His e-mail is mark.ruberto at intel.com.

Ra’anan Sover
Ra’anan Sover received his B.Sc.E.E. degree from the Technion, Israel in 1988. From 1988-2000, he was employed by MicroKim Ltd. as a senior RF engineer. He developed multifunction Hybrid RF synthesizers and control devices. From May 2000 he has worked at Intel as a senior RFIC design engineer and has co-designed the synthesizer block of Intel’s first WLAN RFIC. He now serves as the HW/RF architect of the RF System and Integration Team of WNG. He is a Senior Member of the IEEE. He recently co-authored the award winning "Best of DTTC" paper for 2005 entitled "Silicon-backplane-based integrated RF front-end modules for WLAN applications." His e-mail is raanan.sover at intel.com.

Jorge Myszne
Jorge Myszne received his B.Sc. degree in Electrical Engineering from "Universidad Mayor de la Republica" in Montevideo, Uruguay in 1998. He worked for almost three years in MicroSur Ltd. and joined Intel in 2000. He worked in the DSP/PHY group for four years as a senior DSP engineer and in 2004 he moved to system engineering. He was responsible for the 3945ABG product integration and is now the system engineer leading Intel’s future WLAN products. Jorge authored and co-authored several technical papers and holds seven pending patents. His e-mail is jorge.myszne at intel.com.

Alexander Sloutsky
Alexander Sloutsky is the software lead in the RF System Testing Intel Wireless group. Alexander graduated from Israeli Technion University with a B.Sc. degree in Computer Engineering. He started his career at Intel in the processors department as a student in the 3D HW design group seven years ago. He joined the Wireless Networking Department in 2000 and started his work as a software engineer in the System Validation Tools group. From 2003, his team has been responsible for the development of functional tests for wireless manufacturing and infrastructures for hardware validation and testing. His e-mail is alexander.sloutsky at intel.com.

Yair Shemesh
Yair Shemesh received the his B.Sc.E.E. (Cum Laude) degree in 1985) and his M.Sc.E.E. degree from the Technion in Israel. From 1986 to 2000 he worked for RAFAEL, the Israeli armaments development agency. There, he was a microwave engineer and later a team leader developing microwave circuits and modules in various technologies. Yair designed numerous MMICs with all the major foundries of the time. From 1994 to 2002 he was employed by Alpha Industries Inc, Woburn, MA, (Now Skyworks Inc.) as a senior principal engineer responsible for development of GaAs RFICs and modules mostly for the high-volume cellular market. In 2002 he joined Intel in Haifa Israel where he manages the RFIC design team, developing all Intel’s WLAN radio chips. Yair authored and co-authored over 20 technical papers and patents and is a senior member of the IEEE. His e-mail is yair.shemesh at intel.com.

 

  Section 9 of 9  

In this article
Abstract
Introduction
Architecture
Design considerations and tradeoffs
Manufacturing testing
Conclusion
Acknowledgments
References
Authors' biographies
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