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Volume 10, Issue 02
Intel® Centrino® Duo Processor Technology
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Home  ›  Technology and Research  ›  Intel Technology Journal  ›  Intel® Centrino® Duo Mobile Technology
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 Intel Technology Journal - Featuring Intel's Recent Research and Development
Intel® Centrino® Duo Mobile Technology
Volume 10    Issue 02    Published May 15, 2006
ISSN 1535-864X    DOI: 10.1535/itj.1002.06

  Section 8 of 9  
WLAN System, HW, and RFIC Architecture for the Intel® PRO/Wireless 3945ABG Network Connection
REFERENCES

[1] M. Ruberto, T. Maimon, Y. Shemesh, A. Desormeaux, W. Zhang, C. Yeh, "Consideration of Age Degradation in the RF Performance of CMOS Radio Chips for High Volume Manufacturing," IEEE RFIC Symposium, Long Beach, CA, June 2005, pp. 549-552.

[2] "PCI Express Mini Card Electromechanical Specification," Revision 1.1; March 28, 2005, PCI-SIG.


  Section 8 of 9  

In this article
Abstract
Introduction
Architecture
Design considerations and tradeoffs
Manufacturing testing
Conclusion
Acknowledgments
References
Authors' biographies
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