[1] Eric Samson, Sridhar V. Machiroutu, Je-Young Chang, Ishmael Santos, Jim Hermerding, Ashay Dani, Ravi Prasher, Dawid Song, "Interface Material Selection and Thermal Management Technique in Second-Generation Platforms Built on Intel® Centrino® Mobile Technology," in Intel Technology Journal, Volume 09, Issue 01, February 2005.

[2] Jayesh Iyer, Yuchen Huang, Jerry Shi, "DT in SPD: A Better Approach to System Memory Throttling" at Intel Design & Test Technology Conference, August 15-19, 2005, Portland, OR.

[3] "Mobile Platform Memory Module Thermal Sensor Component Specification," JC-42.4, Ballot proposal (Item number: 1640.07).

[4] JESD21C JEDEC DDR2 SPD Revision 1.1.

[5] "RS-Mobile Intel® 955XM 945 GM/PM/GMS and 940 GML Express Chipset," External Design Specification (EDS), Vol. 1 & 2.

[6] R. S. Prasher, J. Shipley, S. Prstic, P. Koning, and J. L. Wang, "Thermal Resistance of Particle Laden Polymeric Thermal Interface Materials," in Proceedings of International Mechanical Engineering Congress and Exposition, Nov. 15-21, 2003, Washington, D.C.