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Intel Technology Journal - Featuring Intel's Recent Research and Development
Converged Communications
Volume 10    Issue 01    Published February 15, 2006
ISSN 1535-864X    DOI: 10.1535/itj.1001.08

  Section 11 of 12  
Seamless Collaboration–Enabling Best-in-Class VoIP Experience on Intel® Centrino® Mobile Technology
References

[1] IEEE. Part 11, "Wireless LAN Medium Access Control (MAC) and Physical Layer (PHY) Specifications," ANSI/IEEE Std 802.11, 1999 Edition, (ISO/IEC 8802-11:1999(E)).

[2] IEEE. Part 11, "Wireless LAN Medium Access Control (MAC) and Physical Layer (PHY) Specifications: Medium Access Control (MAC) Enhancements for Quality of Service (QoS), ANSI/IEEE Std 802.11e," Draft 13.0, January 2005.

[3] Wi-Fi Alliance, "WMM including APSD Specification," WMM-Specification-draft-050720c.doc.

[4] Rajeev Muralidhar, Ajay Bakre, Hani Elgebaly, "On the Performance of VoIP in EDCA-based IEEE 802.11 WLANs," in Proceedings of World Wireless Congress, 2005.

[5] http://www.skype.com.*

[6] Gordon Chinn et al., "Next-Generation PC Platform Built on Intel® Centrino® Mobile Technology New Usage Models," Intel Technology Journal, Q1'05.

[7] http://www.microsoft.com/msj/0599/LayeredService/
LayeredService.aspx
*

[8] http://www.itu.int/rec/recommendation.asp
?type=products&parent=T-REC-g
*

[9] Bernstein Research Call, Market Survey, "U.S. Telecom: Corporate Shifts to IP Driving Losing Battle for Carriers Within IT Budgets but Price Decays Moderating." May 2005.


  Section 11 of 12  

In This Article
Abstract
Introduction
VoIP Seamless Collaboration Usage Scenarios
VoIP Deployment in Enterprise Networks
VoIP QoS Over WLAN
VoIP Over WLAN Client Architecture
Intel Integrated Performance Primitives
High-Definition Audio and Array Microphone for Open Audio
Conclusions and Future Work
Acknowledgments
References
Authors' Biographies
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