Processors
Intel® Xeon® Processor 5000 Sequence
Integration Overview

The following overview and installation instructions are for professional system integrators building servers that use Intel® Xeon® Processor 5000 Sequence with industry-accepted motherboards, chassis, and peripherals. It contains technical information intended to aid in system integration. Boxed Intel® Xeon® Processor 5000 Sequence product information can be found in the processor product brief and related material.

  • The Boxed Intel® Xeon® Processor 5000 Sequence Overview
    • In the Boxed Processor
    • Identifying a Boxed Processor
  • Platform Requirements Selecting a System Board
    • Heatsink Support
    • Fan Cable Adapter
    • Selecting a Chassis
    • Selecting a Power Supply
  • Integrating an Intel® Xeon® Processor 5000 Sequence-Based System
    • System Board Installation
    • Processor Installation
  • Maintaining and Upgrading an Intel® Xeon® Processor 5000 Sequence-Based System
    • Processor Removal
    • System Memory Upgrades
    • Operating System Support
  • Conclusion

The Boxed Intel® Xeon® Processor 5000 Sequence

Processor Overview

The Intel® Xeon® Processor 5000 Sequence is based on two Intel® NetBurst® micro-architecture and includes several performance enhancing features. The Intel® Xeon® Processor 5000 Sequence introduces several new features including: Intel® Extended Memory 64 Technology, Hardware-Assisted Virtualization via Intel® Virtualization Technology, Thermal Monitor 1 & 2, Enhanced Intel SpeedStep® Technology, Demand Based Switching and retains support for Hyper-Threading Technology.

Two Intel® NetBurst® micro-architecture in the Intel® Xeon® Processor 5000 Sequence and Hyper-Threading Technology enable the processor to achieve breakthrough performance for visual computing, concurrent application environments, and the future of the Internet, while Intel® EM64T provides 64 bit extensions for greater memory access and can increase system performance with optimized applications and operating systems. New power features such as Demand Based Switching, Thermal Monitor 2 and Enhanced Intel SpeedStep® Technology can help to keep system performance running smoothly in higher temperature environments.

The Boxed Intel® Xeon® Processor 5000 Sequence includes two different thermal solutions optimized for different platform form factors: The 1U Passive / 2U+ Active combination solution in the Active Fan configuration is primarily designed to be used in a pedestal chassis where sufficient air inlet space is present and strong side directional airflow is not an issue. The 1U Passive / 2U+ Active solution with the fan removed and the 2U passive solution require the use of chassis ducting and are targeted for use in rack servers

1U Passive / 2U+ Active
Combination Solution
2U Passive Solution
 
 

Both thermal solutions share a common retention base referred to as Common Enabling Kit or CEK. This was done to allow different heat sinks to all attach the same way without modification to the chassis or system board. CEK is a direct chassis attach method allowing the weight of the heat sink to transfer into the chassis back plane. This reduces stress to the system board in the event of a drop or system shock.

Please see the Integration section for full instructions on installing the heat sink solutions into a platform.

Included with the Boxed Intel® Xeon® Processor 5000 Sequence

  • One Intel® Xeon® Processor 5000 Sequence
  • Thermal interface material (Pre-applied to the heat sink solutions in pad form)
  • Passive Heatsink
  • Either 1U passive / 2U+ Active combo or2U passivethermal solution (All with captive hardware)
  • Installation Instructions and Fan-Fold Manual
  • Intel® Inside logo label

Identifying a Boxed Processor

Boxed processor test specifications, or S-Specs, marked on the topside of the Intel® Xeon® Processor 5000 Sequenceidentify specific information about the processor. Using the S-Spec Reference Table and the information marked on the processor, a system integrator can verify the appropriate speed rating, stepping, lot number, serial number and other important information about the processor. The numbers marked on the processor should match the numbers on the processor box label.

Once the boxed processor is installed into a system, the markings on the processor are not visible, and the processor will need to be removed in order to see the markings. In order to avoid this step, there is a sticker provided with the Boxed processor that can be removed and placed inside the chassis. If the processors are upgraded, the markings you've attached to the chassis should be replaced, removed or obviously marked as obsolete to avoid confusion.

Platform Requirements

System integrators building servers based on the boxed Intel® Xeon® Processor 5000 Sequence should use chassis, power supplies, and system boards that are specifically designed for the Intel® Xeon® Processor 5000 Sequence. The only validated chipsets for these processors include the Intel® 5000X, 5000P, and 5000V Chipset.

The Intel® Xeon® Processor 5000 Sequence are not compatible with boards that were designed for earlier Intel® Xeon® Processors-based servers and chipsets. The increased frequency, power, thermals and weight requirements of the Intel® Xeon® Processor 5000 Sequence and thermal solutions, require the platform update.

Selecting a System Board

It is important to verify that the specific system board model, and revision, supports the specific Intel® Xeon® Processor 5000 Sequence frequency being used. A BIOS upgrade may be required in order to properly recognize and support the latest stepping of the Intel® Xeon® Processor 5000 Sequence.

A tested platform reference list will be available shortly after processor launch. This list will contain board and chassis combinations that have been submitted to Intel and have passed our thermal and electrical requihttp://www.corpedia.com/log.asp?uid=4226449rements. There will also a source list of server boards which the hardware vendor has advertised as being specifically designed for boxed Intel® Xeon® Processor 5000 Sequence.

Heatsink Support

The boxed processor will include one of two kinds of unattached heat sink solutions specifically designed to provide sufficient cooling to the Intel® Xeon® Processor 5000 Sequence when used in a suitable chassis environment. The passive heat sink solutions require as close to a 0” bypass around the heat sinks as possible. In other words, it must be a well designed duct with virtually no gaps. The active solution is designed for pedestal chassis that can not properly support ducting, but has sufficient chassis airflow to keep temperature rise to the processor fan inlet from external ambient temperatures down to a minimum. Additional chassis airflow (400 LFM) must also be provided to the voltage regulators located on the system board to insure proper system operation. Chassis that were not specifically designed for the Intel® Xeon® Processor 5000 Sequence will mostly likely not meet the needed requirements.

The heat sink solutions included with the boxed processor ships with pre-applied Thermal Interface Material (TIM). Take care not to disturb the pre-applied TIM before the heat sink is installed. Any removal of the thermal interface material may disrupt the thermal characteristics of the thermal solution and potentially damage the processor

Any time the heat sink is removed after normal operation, it is necessary to reapply thermal interface material.

4-Wire Fan Cable

System board must comes with a 4-pin heat sink fan cable header on the board. The fan headers are keyed so that the connector may only be placed in the proper orientation.

4-Wire Fan Connector
  • Pin 1: Ground
  • Pin 2: +12 V
  • Pin 3: Sense
  • Pin 4: PWM Control (Optional)

System boards must also be able to support the following power guidance:

Description Min Typ
Steady
Max Steady Max
Startup
Unit
+12 V: 12 volt fan power supply 10.8 12 12 13.2 V
IC: Fan Current Draw N/A 1 1.25 1.5 A
SENSE: Sense frequency 2 2 2 2 Pulses per fan revolution

Selecting a Chassis

Chassis that support the boxed Intel® Xeon® Processor 5000 Sequence should comply with SSI specifications for Electronics Entry Bay 3.5 (EEB 3.5) for 2U and above rack and pedestal platforms and TEB 2.0 for 1U rack. These specifications include hole diameters, attach locations and power supply recommendations.

Note SSI specifications and additional information can be found at http://www.ssiforum.org*

It is also highly recommended that the chassis provide sufficient cooling to the processor voltage regulators located on the system board. It is possible to lower overall platform performance if these components are allowed to exceed their operational temperature.

It is expected that the inlet temperature to any of the thermal solution will not exceed 40° Celsius. It is the responsibility of the chassis designer to insure this requirement is meet.

Selecting a Power Supply

System boards supporting the boxed Intel® Xeon® Processor 5000 Sequence include a manual with installation instructions. Consult this manual as well as the boxed processor manual before integrating an Intel® Xeon® Processor 5000 Sequence-based system. In addition, the following information can aid system integrators in successfully integrating a boxed Intel® Xeon® Processor 5000 Sequence-based system.

Integrating an Intel® Xeon® Processor 5000 Sequence-Based System

System boards supporting the boxed Intel® Xeon® Processor 5000 Sequence include a manual with installation instructions. Consult this manual as well as the boxed processor manual before integrating an Intel® Xeon® Processor 5000 Sequence-based system. In addition, the following information can aid system integrators in successfully integrating a boxed Intel® Xeon® Processor 5000 Sequence-based system.

System Board Installation

To begin system installation it is critical to verify that eight removable standoffs, which will be used to attach the processor retention mechanisms, are installed in the chassis base plate.

>
Chassis Before Standoff Installation Chassis After Standoff Installation

Verify Installation of the CEK Springs

Verify that the CEK springs have been installed on your system board. These springs should have shipped with the system board, but if not contact your board manufacture to verify compatibility with the boxed processor heat sink solution. If the CEK springs were not attached to the system board prior to shipping, install them prior to mounting the system board, using proper ESD precautions.

CEK Spring (Included with system board) CEK Springs Installed on Back of System Board

Processor Installation

Mother Board Handling

  1. Remove Motherboard from ESD bag (if applicable)
  2. Visually inspect to ensure socket load lever and load plate are secured
    Caution: Recommend not to open the socket at this time.
  3. Visually inspect to ensure socket protective cover is present and properly secured
    Caution: Recommend not to remove the socket protective cover
  4. Caution: DO NOT TOUCH SOCKET SENSITIVE CONTACTS


Socket Preparation
  1. Opening the socket:

    Note: Apply pressure to the corner with right hand thumb while opening/closing the load lever, otherwise lever can bounce back like a “mouse trap” and WILL cause bent contacts (when loaded)

    1. Disengage Load Lever by depressing down and out on the hook to clear retention tab
    2. Rotate Load Lever to fully open position at approximately 135°
    3. Rotate Load Plate to fully open position at approximately 100°

  2. Remove Socket Protective Cover
    With left hand index finger and thumb to support the load plate edge, engage protective cover finger tab with right hand thumb and peel the cover from LGA771 Socket while pressing on center of protective cover to assist in removal.

    1. Set protective cover aside. Always put cover back on if the processor is removed from the socket.
    2. Visually inspect protective cover for damage. If damage observed, replace the cover.

      NOTE: After cover removal, make sure socket load plate and contacts are free of foreign material. Debris may be removed with compressed air.

      NOTE: Removing protective cover after CPU insertion will compromise the ability to visually inspect socket.


  3. Visually inspect for bent contacts
    If any socket/motherboard mishandling is suspected, socket should be closely examined .
    Closing one eye, inspect socket contacts from different angles to find any damaged contacts. If any are found do not use motherboard. (Since these systems for the lab are non operational, you can use a damaged socket.)



Table 2: Bent Contact Causes and Corrective Actions

FailureType

Potential Causes Possible Corrective Action
1,5
  • CPU Tilted during installation or removal
  • Glove/finger snag
  • Verify CPUs are installed and removed vertically ONLY

– Vacuum wands may be considered

  • Verify CPUs are being held by the substrate edge ONLY
1,5
  • Glove/finger snag
  • CPU Capacitors dragging
  • Verify Packages are held by substrate edges ONLY
  • Verify CPUs are lifted and placed vertically ONLY

– Vacuum wands may be considered

2
  • CPU Tilted during installation or removal
  • CPU dragged across contacts during installation or removal
  • CPU dropped during installation or removal
  • Socket Protective cover dropped into socket
  • Verify Packages are held by substrate edges ONLY
  • Verify CPUs are lifted and placed vertically ONLY

– Vacuum wands may be considered

3
  • CPU tilted during installation or removal
  • CPU dragged across contact array
    Glove/finger snag
  • Verify Packages are held by substrate edges ONLY
  • Verify CPUs are lifted and places vertically ONLY

– Vacuum wands may be considered

4
  • Socket supplier defect
  • Glove/finger snag
  • CPU Capacitors draggin
Return motherboard to manufacture
  • Verify Packages are held by substrate edges ONLY
  • Verify CPUs are lifted and places vertically ONLY

– Vacuum wands may be considered



Boxed Processor Installation
As a supplement to the manual provided with the boxed processor, install the processor and fan heatsink in the following manner.

Processor Handling
  1. Open boxed processor packaging.
  2. Visually inspect to ensure processor protective cover is present and properly secured

    CAUTION: Recommend not to remove the processor protective cover

  3. CAUTION: DO NOT TOUCH PROCESSOR SENSITIVE CONTACTS AT ANY TIME DURING INSTALLATION.


Processor Installation
  1. Lift processr package from shipping media by grasping the substrate edges ONLY.

    NOTE: Orient processor package such that the Connection 1 triangle mark is on bottom left and both key notches are on left side

  2. Processor Protective Cover Handling: Remove protective cover with the opposite hand by depressing larger retention tab and peeling the cover away (figure 8)

  3. Set and reserve the protective cover aside. Always keep the protective side cover on the processor when not in the socket.

  4. Visually inspect the package gold pads:
    Scan the processor package gold pad array for presence of foreign material. If necessary, the gold pads can be wiped cleaned with a soft lint free cloth and isopropyl alcohol (IPA).

  5. Locate Connection 1 indicator and the two orientation key notches. (Figure9)

  6. Grasp the processor with thumb and index finger. (Grasp the edges without the orientation notches.) The socket has cutouts for your fingers to fit into. (FIgure10)

  7. Carefully place the package into the socket body using a purely vertical motion. (Tilting the processor into place or shifting it into place on the socket can damage the sensitive socket contacts.) (Figure11)

    CAUTION: Recommend not to use a Vacuum Pen for installation.

  8. Verify that package is within the socket body and properly mated to the orientation keys

  9. (Figure12) Close the socket by:
    1. Close the Load Plate

    2. While pressing down lightly on Load Plate, engage the Load Lever.

    3. Secure Load Lever with Load Plate tab under retention tab of Load Lever

Thermal interface material should be pre-applied to the heat-sink solution. It will appear like a dry grey material located in the center position under the heat sink solution. If the heat sink solution is removed after the system is booted it will be necessary to clean the old thermal interface material off and replace it with a new TIM pad or thermal grease. Contact Intel® Customer Support to get replacement TIM pads or grease.

Warning:
There is a potential risk of breaking the heat sink screws if they are over tightened beyond specification during installation. The screws that are used to secure the heat sink to the chassis back plane are designed for a maximum torque of 20 foot pounds. Exceeding this specification may result in the screw head breaking off.

Integrators must continue to use caution during the installation of the thermal solution to avoid over torque the heat sink screws. It is recommended that during installation that each screw is started. Then tighten the screws using a crisscross pattern.

Align Heat Sink Carefully Avoid Over Tightening: Over tightening can result in damage to the processor, heat sink, chassis, and or the server board.

If using the active heat sink as shown in the images above make sure to connect the heat sink power header to the system board. The fan/board header may either come in a 3-pin or 4-pin variety. Both headers should be compatible with each other.

Connect Active Heat
Sink Power to CPU
Fan Header

Maintaining and Upgrading an Intel® Xeon® Processor 5000 Sequence-Based System

Processor Removal

Every time the heat sink is removed from the processor, it is critical that more thermal interface material be applied to the processor's integrated heat spreader in order to ensure proper thermal transfer to the boxed processor fan heat sink.

To order new accessories for your Intel Xeon processor, please go to this site: Spares Support

Caution: If you find that considerable force is required to remove the boxed processor assembly, consider wearing gloves to protect your hands and take care to keep your hands away from any metal edges on the chassis when removing components.

Operating System Support

System performance is greatly affected by proper operating system and driver installation processes. For example, it is important to install the latest Intel® Chipset Software Installation Utility immediately after installing most Microsoft operating systems to ensure proper drivers for the chipset are installed prior to installation of other drivers. System integrators should confirm boxed Intel Xeon processor-based systems are optimally configured and integrated.

Conclusion
Boxed Intel® Xeon® Processor 5000 Sequence -based systems require proper integration. System integrators that follow the guidelines in this document will experience higher customer satisfaction by providing higher quality systems. This document has explained the new requirements for:

  • Mechanical support through the chassis
  • Electrical support from the Intel Xeon processor workstation or EPS12V compliant power supply
  • Thermal dissipation from the heat sink and system fans
  • Operating System Optimization

This applies to:

Intel® Xeon® Processor 5000 Sequence

Solution ID: CS-022302
Last Modified: 08-Oct-2014
Date Created: 20-Feb-2006
Back to Top