Processors
Intel® Xeon® Processor 5000 Sequence
Choosing the Thermal Solution for Intel® Xeon® Processors 5000 - 5400 series

Intel is offering the Boxed Intel® Xeon® Processor 5000 Sequence in two heatsink configurations available for each frequency; the 1U Passive/2U+ Active Combination Solution and the 2U Passive Solution. Boxed processor product order codes ending with the letter "A" are the 1U Passive/2U+ Active Combination solutions. Boxed processor product order codes ending with the letter "P" are the 2U Passive solution.

The 1U Passive/2U+ Active combination (pictured below on the left) solution in the Active Fan configuration is primarily designed to be used in a pedestal chassis where sufficient air inlet space is present and strong side directional airflow is not an issue. The 1U Passive/2U+ Active solution with the fan removed require the use of chassis ducting and are targeted for use in rack servers. Use of this thermal solution with the fan removed is intended for 1U server chassis designs.

The 2U Passive solution (pictured below on the right) requires the use of chassis ducting and is targeted for use in rack servers. Use of this thermal solution is intended for 2U server chassis designs.

This applies to:

Intel® Xeon® Processor 5000 Sequence

Solution ID: CS-022301
Last Modified: 17-Jul-2014
Date Created: 20-Feb-2006
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