Updated June 2002
This document is meant to help integrators install a Boxed Intel® Xeon® processor with 512KB L2 cache into 1U (1.75 inches tall) rack mount server systems. The retention mechanism and clips are identical to the general purpose boxed Intel Xeon processor, so it will not cover those steps in detail. Instead, it will concentrate on the specific issues surrounding the 1U product. If you require the full integration details, please see the Integration Overview on the Intel Xeon Processor landing page.
Make sure that you have all the components that come in the boxed processor handy before you begin the installation process. The Boxed processor should contain the following:
(1) Intel Xeon processor
The heatsink comes with a clear plastic cover over it. This is to prevent fin damage during shipping.
(1) Copper heatsink
(2) Retention Mechanisms
(2) Retention Clips
(1) Thermal Interface Material
(1) Foam Pad
Figure 1: 1U Boxed Intel Xeon processor components
400MHz Front Side Bus processors and 533MHz Front Side Bus processors have different pin configurations. The Intel Xeon Processor with a 400MHz Front Side Bus is packaged in the 603-pin OLGA On Interpose (UI) package. The Intel Xeon Processor with a 533MHz Front Side Bus is packaged in the 604-pin Flip Chip-Micro Pin Grid Array 2 (FC-mPGA2) package. Both the Organic Land Grid Array (OLGA) core and Flip Chip-Micro Pin Grid Array 2 (FC-mPGA2) package are covered by an Integrated Heat Spreader (IHS) that helps heatsink dissipation to a properly attached heatsink.
The Intel Xeon Processor with a 400MHz Front Side Bus (603-pin) will fit into the 533MHz FC-mPGA2 package (604-pin) and will functional normally, i.e., it will drop the board frequency down to 400MHz. The Intel Xeon Processor with a 533MHz Front Side Bus (604-pin) will NOT fit into the 400MHz Front Side Bus (603-pin) socket and will damage the processor. Attempting to fit the Intel Xeon Processor with a 533MHz Front Side Bus (604-pin) into the 400MHz Front Side Bus (603-pin) package may void the warranty.
400MHz Front Side Bus processors and 533MHz Front Side Bus processors have different package types that result in different heights. This change requires a separate clip. See Figures 1A and 1B. The correct clip will be shipped with the processor.
Figure 1A: 400MHz FSB Processor Clip
Figure 1B: 533MHz FSB Processor Clip
Note: The cover must be removed prior to installation
To remove the cover, place your fingers under the heatsink. Pull the tabs under the heatsink outward while pushing down on the heatsink with your thumbs. The heatsink should slide out of the cover and drop into your hands. Refer to Figure 2 to see how this is done.
Figure 2: Removing Heatsink Cover
Processor and Heatsink
Installing the processor and heatsink
The first step is to install the processor. Lift the lever on the processor socket to allow the processor to be inserted. Place the processor into the socket, making sure that pin 1 of the processor is aligned with pin 1 of the socket. The pins are keyed in such a way that you cannot install it in the wrong orientation without bending pins. Make sure to push the lever back down so the socket makes firm contact with the processor pins.
Now screw the retention mechanisms (RM) through the board and into the chassis standoffs. You can mount these prior to installing the processor, but then it is more difficult to lift the socket lever. Now the thermal interface material (grease in the syringe) may be applied. Take the syringe that contains the grease and apply the full amount to the center of the integrated heat spreader on the processor. Once the grease is in place, put the copper heatsink onto the processor, and gently rock it to spread the grease out. Finally clip the heatsink down. Remember to put the center tab into the clip first, then slide the left side of the clip onto the RM tab. It is easier to install the other clip before completely installing the first one. Otherwise, one side of the heatsink lifts up and makes it difficult to attach the other clip. Finish the clip install by pressing on the remaining side until it engages with the RM tab. When these steps are complete, the system should look similar to this.
Figure 3: Heatsinks installed
Installing the Foam Pad
A foam pad is included with the boxed processor. This pad is designed to prevent air from flowing over the top of the heatsink. It must be attached to the top of the heatsink in order to have sufficient airflow through the heatsink. Remove the adhesive backing from the pad, and then place the pad on the heatsink fins. Try to center it, but don't worry if it is a little off center. The pad is larger than the sink, so it will overhang. See Figure 4 and Figure 5.
Figure 4: Remove Adhesive Backing
Figure 5: Place pad on sink
The heatsink will not perform properly without sufficient airflow. Because of the fin density, air will flow around the heatsink if allowed. The foam pad prevents air from flowing over the top of the heatsink, and forces the air to flow through it. Failure to attach the pad may cause the processor to operate out of specification and reduce it's life expectancy.
This applies to: