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This document discusses thermal management and measurement techniques for the 64-bit Intel® Xeon® Processor MP with up to 8MB L3 cache which is primarily intended for server applications. It will also address the issues of the integrated thermal management logic and its impact on thermal design. The physical dimensions and power numbers used in this document are for reference only. Please refer to the Intel Xeon processor datasheet for the product dimensions, thermal power dissipation and maximum case temperature. In case of conflict, the data in the datasheet supersedes any data in this document.
This document discusses thermal management and measurement techniques for the 64-bit Intel® Xeon® Processor MP with 1MB L2 cache which is primarily intended for server applications. It will also address the issues of the integrated thermal management logic and its impact on thermal design. The physical dimensions and power numbers used in this document are for reference only. Please refer to the Intel Xeon processor datasheet for the product dimensions, thermal power dissipation and maximum case temperature. In case of conflict, the data in the datasheet supersedes any data in this document.
This document provides Intel's recommendations for servers based on the Intel® Xeon® Processor MP and the Intel® Xeon® Processor MP with up to 2-MB L3 Cache on the 0.13 micron process.
This document defines DC-to-DC converters to meet the power requirements of computer systems using the 64-bit Intel® Xeon® processor MP with 1MB L2 cache and 64-bit Intel® Xeon® processor MP with up to 8MB L3 cache products. VRM/EVRD requirements will vary according to the needs of different computer systems, including the range of processors a specific VRM/EVRD is expected to support in a system. The "VRM" designation refers to a voltage regulator module that is plugged into a system board and the "EVRD" designation refers to a motherboard embedded voltage regulator.
This document defines DC-to-DC converters to meet the power requirements of computer systems using the 64-bit Intel® Xeon® processor MP with 1MB L2 cache and 64-bit Intel® Xeon® processor MP with up to 8MB L3 cache products. VRM/EVRD requirements will vary according to the needs of different computer systems, including the range of processors a specific VRM/EVRD is expected to support in a system. The "VRM" designation refers to a voltage regulator module that is plugged into a system board and the "EVRD" designation refers to a motherboard embedded voltage regulator.
This document defines DC-to-DC converters to meet the power requirements of computer systems using the 64-bit Intel® Xeon® processor MP with 1MB L2 cache and 64-bit Intel® Xeon® processor MP with up to 8MB L3 cache products. VRM requirements will vary according to the needs of different computer systems, including the range of processors a specific VRM is expected to support in a system. The "VRM" designation refers to a voltage regulator module that is plugged into a system board.
This document discusses thermal management and measurement techniques for the Intel® Xeon® processor 2.80 GHz. It is primarily intended for server applications. It will also address the issues of the integrated thermal management logic and its impact on thermal design. The physical dimensions and power numbers used in this document are for reference only. Please refer to the Intel Xeon processor datasheet for product dimensions, thermal power dissipation and maximum case temperature. In case of conflict, the data in the datasheet supersedes any data in this document.
This document details the guidelines for developing a single embedded voltage regulator circuit (VRD) to supply the required current and voltage to the common power plane for two Intel Xeon processors on a dual-processor-capable system board. The parameters specified in this document are provided as guidelines only. For the most current processor specifications please refer to the appropriate component datasheet.
This document describes the required changes to help ensure that Intel® Xeon® processor-based platforms offer compatibility for the Intel® Xeon® processor with 512 KB L2 cache.
This document discusses thermal management and measurement techniques, and provides details on the Intel-enabled thermal solutions for the Intel® Xeon® processor with 800 MHz system bus product.
For use with Intel® Xeon® Processors with 512-KB L2 Cache and Intel® Xeon® Processors with 533 MHz System Bus. For designing a single platform compatible with both the Intel® E7500 and E7501 chipsets.
This design guide document is Intel's design recommendations for systems based on the Intel® Xeon® processor with 512-KB L2 cache, Intel® Xeon® processor with 533 MHz system bus and the Intel® E7500/E7501 chipset. This guide is intended for Intel E7500/E7501 chipset compatible platforms. All new Intel E7500 chipset platforms should use this document. Existing Intel E7500 chipset-only designs may still conform to the Intel® Xeon® Processor with 512-KB L2 Cache and Intel® E7500 Chipset Platform Design Guide. In addition to providing motherboard design recommendations (e.g., layout and routing guidelines), this document addresses system design issues (e.g., power delivery).
This document discusses thermal management and measurement techniques for the 64-bit Intel® Xeon® Processor with 2MB L2 cache is primarily intended for server and workstation applications. It will also address the issues of the integrated thermal management logic and its impact on thermal design. The physical dimensions and power numbers used in this document are for reference only. Please refer to the Intel Xeon datasheet for the product dimensions, thermal power dissipation and maximum case temperature. In case of conflict, the data in the datasheet supersedes any data in this document.
This document provides functional, quality, reliability, and material requirements and design guidelines for the 604-pin socket used with Intel® Xeon® processors.
This document has two primary roles in the design process. First and foremost this document is a location for recording all of the best-known methods relating to the design of an ITP700 based scan chain in a target. Second, this document serves as the Intel communication of Design Guide and In Target Probe (ITP) signal specifications for a given processor. The document is structured to serve both purposes.
This document defines DC-to-DC converters designed to help meet the power requirements of the Intel® Xeon® Processor with 800 MHz system bus.
This document defines one or more DC-to-DC converters to meet the power requirements of computer systems using Intel® Xeon® and 64-bit Intel® Xeon® processors MP microprocessors. It does not attempt to define a specific voltage regulator module (VRM) implementation. VRM requirements will vary according to the needs of different computer systems, including the range of processors a specific VRM is expected to support in a system. The "VRM" designation refers to a voltage regulator module that is plugged into a system board.
This document provides functional, quality, reliability, and material requirements and design guidelines for the 603-pin socket used with the Intel® Xeon® processor.
The goals of this document are to:
- Explain the thermal and mechanical specification for the Intel® Xeon® processor LV.
- Describe a reference thermal solution that meets the specifications.
This design guide defines the power delivery features necessary to support Intel processor's power delivery requirements for embedded computer applications using the Intel® Xeon® Processor LV family. This includes design recommendations for DC to DC regulators, which convert the input supply voltage to a processor consumable voltage (VCC) and additional specific feature set implementation, such as thermal monitoring and dynamic voltage identification.
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