The following overview and installation instructions are for professional system integrators building servers that use Intel® Xeon™ processors with industry-accepted motherboards, chassis, and peripherals. It contains technical information intended to aid in system integration. Boxed Intel Xeon Processor product information can be found in the processor product brief and related material.
Platform Requirements Selecting a System Board
- The Boxed Intel® Xeon™ Processor Processor Overview
- In the Boxed Processor
- Identifying a Boxed Processor
Integrating an Intel® Xeon™ Processor-Based System
- Heatsink Support
- Fan Cable Adapter
- Selecting a Chassis
- Selecting a Power Supply
Maintaining and Upgrading an Intel Xeon Processor-Based System
- System Board Installation
- Processor Installation
- Processor Removal
- System Memory Upgrades
- Operating System Support
The Boxed Intel® Xeon™ Processor with 800 MHz system bus
The Intel® Xeon™ Processor with 800 MHz system bus is based on Intel NetBurst® micro-architecture and includes several performance enhancing features. The Intel® Xeon™ processor introduces several new features including: Intel® Extended Memory 64 Technology, Thermal Monitor 1 & 2 and Enhanced Intel SpeedStep® Technology and retains support for Hyper-Threading Technology.
Intel NetBurst® micro-architecture and Hyper-Threading Technology enable the Intel Xeon Processor to achieve breakthrough performance for visual computing, concurrent application environments, and the future of the Internet, while Intel® 64 provides 64 bit extensions for greater memory access and can increase system performance with optimized applications and operating systems. New power features such as Thermal Monitor 2 and Enhanced Intel SpeedStep® Technology can help to keep system performance running smoothly in higher temperature environments.
The Boxed Intel® Xeon™ Processor with 800 MHz system bus includes three different heat sink solutions optimized for different platform form factors: 1U passive for 1U rack configurations (requires ducting), 2U passive for 2U and above rack and pedestal applications (requires ducting) and finally the active heat sink solution for pedestal chassis.
|Passive 1U Heat Sink
||Passive 2U Heat Sink
||Active Heat Sink |
All three heat sink solutions share a common retention base referred to as Common Enabling Kit or CEK. This was done to allow different heat sinks to all attach the same way without modification to the chassis or system board. CEK is a direct chassis attach method allowing the weight of the heat sink to transfer into the chassis back plane. This reduces stress to the system board in the event of a drop or system shock.
Please see the Integration section for full instructions on installing the heat sink solutions into a platform.
Included with the Boxed Intel® Xeon™ Processor
- Intel® Xeon™ Processor with 800 MHz system bus
- Thermal interface material (Pre-applied to the heat sink solutions in pad form)
- Passive Heatsink
- Either 1U passive, 2U passive or Active heat sink solution (All with captive hardware)
- Installation Instructions and Fan-Fold Manual
- Intel® Inside logo label
Identifying a boxed processor
Boxed processor test specifications, or S-Specs, marked on the underside of the Intel® Xeon™ Processor identify specific information about the processor. Using the S-Spec Reference Table and the information marked on the processor, a system integrator can verify the appropriate speed rating, stepping, lot number, serial number and other important information about the processor. The numbers marked on the processor should match the numbers on the processor box label.
Once the boxed processor is installed into a system, the markings on the processor are not visible, and the processor will need to be removed in order to see the markings. In order to avoid this step, there is a sticker provided with the Boxed processor that can be removed and placed inside the chassis. If the processors are upgraded, the markings you've attached to the chassis should be replaced, removed or obviously marked as obsolete to avoid confusion.
System integrators building servers based on the boxed Intel® Xeon™ Processor with 800 MHz system bus should use chassis, power supplies, and system boards that are specifically designed for the Intel® Xeon™ Processor with 800 MHz system bus. The only validated chipsets for these processors include the Intel® E7520, Intel® E7525 and Intel® E7320.
The Intel® Xeon™ Processor with 800 MHz system bus is not compatible with boards that were designed for the Intel® Xeon™ Processor with 533 MHz system bus, or earlier Intel® Xeon™ Processors including chipsets: Intel® E7501 and Intel® E7505 and Intel® E7500. This is also true of 3rd party chipsets. The increased frequency, power, thermals and weight requirements of the Intel® Xeon™ Processor with 800 MHz system bus and heat sink solutions, require the platform update.
Selecting a system board
It is important to verify that the specific system board model, and revision, supports the specific Intel® Xeon™ Processor frequency being used. A BIOS upgrade may be required in order to properly recognize and support the latest stepping of the Intel® Xeon™ Processor.
A tested platform reference list will be available shortly after processor launch. This list will contain board and chassis combinations that have been submitted to Intel and have passed our thermal and electrical requirements. There will also a source list of server boards which the hardware vendor has advertised as being specifically designed for boxed Intel® Xeon™ Processors with 800 MHz system bus.
The boxed processor will include one of three kinds of unattached heat sink solutions specifically designed to provide sufficient cooling to the Intel® Xeon™ Processor with 800 MHz system bus when used in a suitable chassis environment. The passive heat sink solutions require as close to a 0” bypass around the heat sinks as possible. In other words, it must be a well designed duct with virtually no gaps. The active solution is designed for pedestal chassis that can not properly support ducting, but has sufficient chassis airflow to keep temperature rise to the processor fan inlet from external ambient temperatures down to a minimum. Additional chassis airflow (400 LFM) must also be provided to the voltage regulators located on the system board to insure proper system operation. Chassis that were not specifically designed for the Intel® Xeon™ Processor with 800 MHz system bus will mostly likely not meet the needed requirements.
The heat sink solutions included with the boxed processor ships with pre-applied Thermal Interface Material (TIM). Take care not to disturb the pre-applied TIM before the heat sink is installed. Any removal of the thermal interface material may disrupt the thermal characteristics of the thermal solution and potentially damage the processor
Any time the heat sink is removed after normal operation, it is necessary to reapply thermal interface material.
Fan cable Adapter
System boards may either come with a 3-pin or 4-pin heat sink fan cable header on the board. Either header should work acceptably well. The fan headers are keyed so that the connector may only be placed in the proper orientation.
|3-Wire Fan Connector
||4-Wire Fan Connector |
- Pin 1: Ground
- Pin 2: +12 V
- Pin 3: Sense
- Pin 4: PWM Control (Optional)
System boards must also be able to support the following power guidance:
|+12 V: 12 volt fan power supply
|IC: Fan Current Draw
|SENSE: Sense frequency
||Pulses per fan revolution|
Selecting a chassis
Chassis that support the boxed Intel® Xeon™ Processor with 800 MHz system bus should comply with SSI specifications for Electronics Entry Bay 3.5 (EEB 3.5) for 2U and above rack and pedestal platforms and TEB 2.0 for 1U rack. These specifications include hole diameters, attach locations and power supply recommendations.
NOTE: SSI specifications and additional information can be found at http://www.ssiforum.org
It is also highly recommended that the chassis provide sufficient cooling to the processor voltage regulators located on the system board. It is possible to lower overall platform performance if these components are allowed to exceed their operational temperature.
It is expected that the inlet temperature to any of the heat sink solutions will not exceed 40° Celsius. It is the responsibility of the chassis designer to insure this requirement is meet.
Selecting a power supply
System boards supporting the boxed Intel® Xeon™ Processor include a manual with installation instructions. Consult this manual as well as the boxed processor manual before integrating an Intel® Xeon™ Processor-based system. In addition, the following information can aid system integrators in successfully integrating a boxed Intel® Xeon™ Processor-based system.
Integrating an Intel® Xeon™ Processor-based system
System boards supporting the boxed Intel® Xeon™ Processor include a manual with installation instructions. Consult this manual as well as the boxed processor manual before integrating an Intel Xeon processor-based system. In addition, the following information can aid system integrators in successfully integrating a boxed Intel Xeon processor-based system.
System board installation
To begin system installation it is critical to verify that eight removable standoffs, which will be used to attach the processor retention mechanisms, are installed in the chassis base plate.
|Chassis Before Standoff Installation
||Chassis After Standoff Installation|
Verify installation of the CEK springs
Verify that the CEK springs have been installed on your system board. These springs should have shipped with the system board, but if not contact your board manufacture to verify compatibility with the boxed processor heat sink solution. If the CEK springs were not attached to the system board prior to shipping, install them prior to mounting the system board, using proper ESD precautions.
|CEK Spring (Included with system board)
||CEK Springs Installed on Back of System Board |
Open the processor socket handle and align the processor using the pin one markings on the processor and socket for reference. The processor pin one marking on the interposer of the FC-uPGA4 package should be aligned with pin one mark on the socket. Markings on the integrated heat spreader should not be used for installation alignment. Insert the processor into the socket and close the socket handle.
|Open Socket Handle
||Lock Socket |
Thermal interface material should be pre-applied to the heat-sink solution. It will appear like a dry grey material located in the center position under the heat sink solution. If the heat sink solution is removed after the system is booted it will be necessary to clean the old thermal interface material off and replace it with a new TIM pad or thermal grease. Contact Intel® Customer Support to get replacement TIM pads or grease.
|Heat Sink TIM Pad
||Install Heat Sink Solution
||Tighten Screws |
There is a potential risk of breaking the heat sink screws if they are over tightened beyond specification during installation. The screws that are used to secure the heat sink to the chassis back plane are designed for a maximum torque of 20 inch pounds. Exceeding this specification may result in the screw head breaking off.
Beginning in September 2004, Intel Corporation began using a heat sink screw with higher torque tolerance. This change has occurred on all Intel® Xeon™ processors with 800 MHz system bus, and on all three thermal solutions. See table below for effected products.
Integrators must continue to use caution during the installation of the thermal solution to avoid over torque the heat sink screws. It is recommended that during installation that each screw is started. Then tighten the screws using a crisscross pattern.
Align heat sink carefully, avoid over tightening: Over tightening can result in damage to the processor, heat sink, chassis, and or the server board.
Only product packaged before September 2004 is effected. Product packaged after September 2004 uses the new screw with increased torque specifications. Continued caution with the new screw should be taken during integration to avoid over tightening the screw.
If using the active heat sink as shown in the images above make sure to connect the heat sink power header to the system board. The fan/board header may either come in a 3-pin or 4-pin variety. Both headers should be compatible with each other.
|Connect Active Heat |
Sink Power to CPU
Maintaining and upgrading an Intel Xeon Processor-based system
Every time the heat sink is removed from the processor, it is critical that more thermal interface material be applied to the processor's integrated heat spreader in order to ensure proper thermal transfer to the boxed processor fan heat sink.
To order new accessories for your Intel Xeon processor, please go to this site: Spares Support
Caution: If you find that considerable force is required to remove the boxed processor assembly, consider wearing gloves to protect your hands and take care to keep your hands away from any metal edges on the chassis when removing components.
System memory upgrades
When upgrading system memory, it is preferable to match the memory speed and type of the memory installed in the system. For example, a system with DDR2 400 MHz DRAM should be complimented with more DDR2 400 MHz DRAM, preferable from the same manufacture. Although certain combinations may be supported by the chipset (i.e. different memory speeds that default to the lower speed of the two installed), it is critical to verify system board support for any memory combination used (speed, type, size).
Operating system support
System performance is greatly affected by proper operating system and driver installation processes. For example, it is important to install the latest Intel® Chipset Software Installation Utility immediately after installing most Microsoft operating systems to ensure proper drivers for the chipset are installed prior to installation of other drivers. System integrators should confirm boxed Intel Xeon processor-based systems are optimally configured and integrated.
Boxed Intel® Xeon™ processor-based systems require proper integration. System integrators that follow the guidelines in this document will experience higher customer satisfaction by providing higher quality systems. This document has explained the new requirements for:
- Mechanical support through the chassis
- Electrical support from the Intel Xeon processor workstation or EPS12V compliant power supply
- Thermal dissipation from the heat sink and system fans
- Operating System Optimization
This applies to: