Processor Physical Damage Information - Damage Due to External Causes

Processor physical damage information (damage to the product due to external causes)

  • Damage is caused by improper integration, installation or usage of the product outside of its designed specifications. Improper packaging of the returned product while shipping back to Intel may also cause this damage to occur during the transportation process.
  • Customer returned product is visually inspected for damage due to external causes upon receipt of the product at an Intel authorized location. The products are visually screened using the naked eye or a 3X magnification scope without applying any mechanical or electrical pressure on the products.
  • Physical damage information (damage to the product due to external causes) indicates that the products was tampered with and changed from its original shipment & usage condition and Violates the Intel Warranty Policy as stated below:
Note Any mark left by the motherboard sockets under normal usage is not considered damage to the product due to external causes.

For more warranty information visit the 3 Year Limited Warranty for Intel® Boxed Processors page.

Possible physical damage to the product due to external causes Categories

Defect Symptom Description Examples
Components Missing or Damaged The component is missing from the required location or there is evidence of crack, chips and damages to the components.

Picture above: Missing component

Picture above: Cracked component
Heat Spreader Damages / Cracks / Scratches. Reject if there is any cracks, breaks, chips, smashed corners, peeling, or blistering on the heat spreader. Reject if Scratches are exposing the base metal.

Picture above: indicates that the heat spreader is deeply scratch
Package - Damaged/Deformed

(*Package is also known as substrate)
Package is damaged with cracks, trace cuts, expose trace, masking peel-offs caused by dropping or misusage of the product.

Picture above: masking peel-offs
Contamination or Foreign Material Presence of foreign material on Package, land pads & pins. Foreign materials could not be removed using approved cleaning solvent.

Picture above: Foreign Material on CPU surface & land pads

Picture above: Foreign Material on CPU Pins
Damaged / Bent Pins Gross bent pin, compound bow or twisted pin which prevents the processor from properly being installed in the CPU socket. This includes missing pins.

Picture above: CPU Pins are bent

Silicon (Die) - Damaged/Deformation
Chip-off or crack on the die side.

Picture above: Chip off on the edge of CPU Die
Silicon (Die) - Scratches scratch with length > ~25% of the shortest die lengthor > 3 Visible scratches.

Picture above: Scratch on the on the CPU Die more than 25% of the length

Picture above: >3 Visible Scratches
Thermally Damaged CPU Thermal Damage (Burn Mark) on CPU Package, Components or die.

Picture above : CPU is thermally damaged

Appendix A

This applies to:

Intel® Core™ i3 Desktop Processor
Intel® Core™ i5 Desktop Processor
Intel® Core™ i7 Desktop Processor
Intel® Core™ i7 Processor Extreme Edition
Intel® Core™2 Duo Desktop Processor
Intel® Core™2 Extreme Processor
Intel® Core™2 Quad Processor
Intel® Pentium® Processor for Desktop

Solution ID: CS-031460
Last Modified: 09-Feb-2015
Date Created: 03-Mar-2010
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