|Components Missing or Damaged
||The component is missing from the required location or there is evidence of crack, chips and damages to the components.
Picture above: Missing component
Picture above: Cracked component
|Heat Spreader Damages / Cracks / Scratches.
||Reject if there is any cracks, breaks, chips, smashed corners, peeling, or blistering on the heat spreader. Reject if Scratches are exposing the base metal.
Picture above: indicates that the heat spreader is deeply scratch
|Package - Damaged/Deformed
(*Package is also known as substrate)
|Package is damaged with cracks, trace cuts, expose trace, masking peel-offs caused by dropping or misusage of the product.
Picture above: masking peel-offs
|Contamination or Foreign Material
||Presence of foreign material on Package, land pads & pins. Foreign materials could not be removed using approved cleaning solvent.
Picture above: Foreign Material on CPU surface & land pads
Picture above: Foreign Material on CPU Pins
|Damaged / Bent Pins
||Gross bent pin, compound bow or twisted pin which prevents the processor from properly being installed in the CPU socket. This includes missing pins.
Picture above: CPU Pins are bent
Silicon (Die) - Damaged/Deformation
|Chip-off or crack on the die side.
Picture above: Chip off on the edge of CPU Die
|Silicon (Die) - Scratches
||scratch with length > ~25% of the shortest die lengthor > 3 Visible scratches.
Picture above: Scratch on the on the CPU Die more than 25% of the length
Picture above: >3 Visible Scratches
|Thermally Damaged CPU
||Thermal Damage (Burn Mark) on CPU Package, Components or die.
Picture above : CPU is thermally damaged