Processors
Desktop
Processor Integration Overview (LGA115x)

The following overview and installation instructions are for professional system integrators building ATX form factor PCs that use Boxed Intel® processors in the 115x-land package with industry-accepted motherboards, chassis, and peripherals. It contains technical information intended to aid in system integration. An integration video is also available to help system integrators accurately build systems based on boxed Intel processors.

Note

This integration documentation refers to the installation of both LGA1156-based processors and fan-heatsinks and LGA1155-based processors and fan-heatsinks due to the similarity between the two installations.

The same fan-heatsinks may be used across the two sockets provided that the Thermal Design Profile (TDP) of the processor is the same. The fan-heatsink installation is identical across both sockets.

Be aware that LGA1156-based processors and LGA1155-based processors are not compatible between sockets due to electrical, mechanical, and keying differences. You risk damaging either the processor or the socket if you try and install a LGA1156-based processor in a LGA1155 socket or vice versa.

Table of contents

Handling procedures:

Boxed processor installation:

Boxed processor removal:

    Motherboard handling

    1. Remove motherboard from ESD bag (if applicable).
    2. Make sure socket load lever and load plate are secured. Do not open socket at this time.
    3. Inspect to ensure socket protective cover is present and properly secured. Do not remove socket protective cover.
    4. Do not touch socket sensitive contacts (see image below).

    Socket preparation

    1. Opening the socket
    2. Removing the socket protective cover
    3. Inspecting for bent contacts

    A. Opening the socket (see image below):

    Note Apply pressure to corner with right-hand thumb when opening or closing load lever - otherwise lever will bounce back (as a mouse trap) causing bent contacts.

    1. Disengage load lever by releasing down and out on the hook. This will clear retention tab.
    2. Rotate load lever to open position at approximately 135°.
    3. Rotate load plate to open position at approximately 150°.

    B. Removing the socket protective cover:

    Note Vertical removal is NOT recommended, as it requires higher force and can lead to socket contact damage.
    1. Place thumb against the front edge of the protective cover and rest index finger on the rear grip to maintain control of the cover.
    2. Lift the front edge of the protective cover to disengage from the socket. Keep control of the cover by holding the rear grip with index finger.
    3. Lift protective cover away from the socket, being careful not to touch the electrical contacts.
    Caution Never Touch Fragile Socket Contacts to Avoid Damage

      C.  Inspecting for bent contacts:

      1. Inspect socket contacts from different angles to make sure none are damaged. If any are damaged, do not use motherboard.
        Note If any socket or motherboard is suspected of being mishandled, the socket should be examined.

        Five types of contact damage to look for (see Table 1 for potential causes and solutions):

        1. Contact is bent backwards upon itself (see Figure 1).
        2. Content is bent forward or downward (see Figure 2).
        3. Contact is bent sideways (see Figure 3).
        4. Contact tip is bent up (see Figure 4).
        5. Contact tip is missing (same as Figure 4).
        Figure 1. Contact is bent backwards upon itself
        Figure 2. Contact is bent forward or downward
        Figure 3. Contact is bent sideways
        Figure 4. Contact tip is bent up or missing

        Table 1: Bent Contact Causes and Corrective Actions

        FailureType Potential Causes Possible Corrective Action

        1,5

        CPU tilted during installation or removal

        Glove/finger snag

        Verify CPUs are installed and removed vertically ONLY

        Vacuum wands may be considered

        Verify CPUs are being held by the substrate edge ONLY

        1,5

        Glove/finger snag

        CPU capacitors dragging

        Verify packages are held by substrate edges ONLY

        Verify CPUs are lifted and placed vertically ONLY

        Vacuum wands may be considered

        2

        CPU tilted during installation or removal

        CPU dragged across contacts during installation or removal

        CPU dropped during installation or removal

        Socket protective cover dropped into socket

        Verify packages are held by substrate edges ONLY

        Verify CPUs are lifted and placed vertically ONLY

        Vacuum wands may be considered

        3

        CPU tilted during installation or removal

        CPU dragged across contact array

        Glove/finger snag

        Verify packages are held by substrate edges ONLY

        Verify CPUs are lifted and places vertically ONLY

        Vacuum wands may be considered

        4

        Socket supplier defect

        Glove/finger snag

        CPU capacitors dragging

        Return motherboard to manufacture

        Verify packages are held by substrate edges ONLY

        Verify CPUs are lifted and places vertically ONLY

        Vacuum wands may be considered

        Boxed Intel® processor installation

        • Processor handling
        • Processor installation
        • Fan heatsink handling
        • Fan heatsink installation

        Install the processor and fan heatsink in the following manner. Use this in accompaniment with the manual provided.

        A. Processor handling:

        1. Open boxed processor packaging.
        2. Inspect to ensure processor protective cover is present and properly secured. Do not remove processor protective cover.
        3. Caution: DO NOT TOUCH PROCESSOR SENSITIVE CONTACTS AT ANY TIME DURING INSTALLATION (see image below).

        B. Processor installation:
        1. Lift processor package from shipping media by grasping the substrate edges.

           

        2. Scan the processor package gold pads for any presence of foreign material. If necessary, the gold pads can be wiped clean with a soft lint-free cloth and isopropyl alcohol.
        3. Locate connection 1 indicator on the processor which aligns with connection 1 indicator chamfer on the socket, and notice processor keying features that line up with posts along socket walls.

           

        4. Grasp the processor with thumb and index finger along the top and bottom edges. (Do not touch the Orientation Notches.) The socket will have cutouts for your fingers to fit into (see image below).
        5. Carefully place the processor into the socket body vertically (see image below).
          Note Tilting or roughly shifting it into place can damage socket contacts.

          Caution Do not use a vacuum pen for installation.


        6. Verify that package is within the socket body and properly connected to orientation keys.

           

        7. Close the socket (see image below):
          1. Gently lower the load plate.
          2. Make sure load plate's front edge slides under the shoulder screw cap as the lever is lowered.
          3. Latch the lever under the top plate's corner tab, being cautious not to damage the motherboard with the tip of the lever.

        C. Fan heatsink handling:

        1. To prevent damage, avoid setting the thermal solution with the prongs down.
        2. Set on side or with fan down (see image below).

        D. Fan heatsink installation:

        Note The thermal solution integration procedures should be performed with the motherboard in the chassis to provide proper clearance under the motherboard for the fastener mechanisms.
        1. Install the motherboard into the chassis.
          Note Thermal solutions that come with the Boxed Intel® processor use pre-applied thermal interface material (TIM) and do not need grease.

          Caution Do not to touch or disturb the TIM on the heatsink during installation. If the TIM is disturbed contact customer support.
        2. Remove heatsink from packaging.
        3. Place heatsink onto the LGA115x socket.
        4. Ensure fan cables are on side closest to fan header.
        5. Align fasteners with MB through-holes.
        6. Make sure fasteners are flush with motherboard with the following steps (see image below).

          Inspection 1

          1. Ensure cables are not trapped or interfering with fasteners.
          2. Ensure fastener slots are pointing perpendicular to heatsink (see image below).

          Actuate fasteners (see image below):

          1. While holding heatsink, press down on fastener caps with thumb to install and lock.
          2. Repeat with remaining fasteners.

          Inspection 2 (see image below):

          1. Pull on fasteners to verify they are properly seated.
          2. Ensure both fastener cap and base are flush with spring and motherboard and MB.

        7. Connect fan cable to Board CPU header (see image below).

        8. Secure excess cable with tie-wrap to ensure cable does not interfere with fan operation or contact other components.

        Maintaining and upgrading systems based on boxed Intel® processors in the 115x-land package

        • Removing the boxed processor fan heatsink
        • Removing the processor

        A. Removing the boxed processor fan heatsink:

        Note Be sure to take the proper electrostatic discharge (ESD) precautions (ground straps, gloves, ESD mats, or other protective measures) to avoid damaging the processor and other electrical components in the system.

        Follow these steps to remove the boxed processor fan heatsink from the system (see image below):

        1. Disconnect fan cable from motherboard header.
        2. Turn fastener caps (1) counter-clock wise 90° to the un-locked position. (You may need to use a flathead screwdriver to unlock the fasteners.)
        3. Pull up on fastener caps to unseat.
        4. Manually remove heatsink with gentle twisting motion.

          Note To re-assemble the heatsink, reset the fastener caps to their original position with the slot perpendicular to the heatsink. Re-attach cable to cable management clips. Then, follow the assembly instructions (see image below).
          Note Every time the heatsink is removed from the processor, it is critical that the thermal interface material be replaced, in order to ensure proper thermal transfer to the boxed processor fan heatsink.

        B. Removing the processor:

        1. Open the socket:

          1. Disengage the load lever.
          2. Open the load plate.

        2. Remove the Processor package, holding along the top and bottom edges, or by using a vacuum pen.
        3. Maintain Processor horizontal and remove Processor with a vertical motion to avoid damaging the socket contacts.

        4. Place the processor in a specially designed tray or ESD retainer for storage. Do not place directly on table resting on gold lands
        5. Assemble LGA115x socket protective cover:

          1. Hold protective cover at 45 degree angle to the LGA115x Socket
          2. Carefully lower protective cover on hinge side first, to contact with the outside wall of the LGA115x Socket:

            1. Engage protective cover retention features to outside of LGA115x Socket, AND align 2 cover corners to socket corners (This step is critical to avoid Bent Contact Damage!)
            2. Lower protective cover to attach to the LGA115x Socket on Shoulder screw side


          3. Perform Visual and Tactile verification that protective cover is properly seated in the LGA115x Socket:
            • Hold cover and move gently "side to side" to feel the play within the cover and the LGA115x Socket

        6. Close the socket load plate and engage the load lever (see image below).

        This applies to:

        Intel® Core™ i3 Desktop Processor
        Intel® Core™ i5 Desktop Processor
        Intel® Core™ i7 Desktop Processor
        Intel® Pentium® Processor for Desktop

        Solution ID: CS-030850
        Last Modified: 16-Oct-2014
        Date Created: 30-Aug-2009
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