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The Thermal Interface Material (TIM) is used to provide efficient thermal exchange between the processor Integrated Heat Spreader (IHS) and the fan-heatsink. Proper installation of the thermal interface material is crucial to the success of the thermal solution. Failure to properly install the thermal interface material could cause the processor to overheat.
Most of the thermal solutions shipped with the Boxed Intel® Desktop and Server processors have the TIM applied to the bottom of the heatsink in a 3 bar application from the factory as shown below.
Related Information: Intel® Desktop Boxed Processors and Sockets video
If it does not have the TIM applied, it will ship with the TIM pillow pack (E94211-001) in the box.

Replacement or reinstallation of the processor or heat sink requires replacement of the thermal interface material. Application of the thermal interface material to the top of the processor is critical in order to insure effective heat transfer from the processor to the thermal solution. Failure to apply the thermal interface material could cause the processor to either shut down or operate inefficiently.
Intel will be offering the thermal interface material replacement in a syringe and pillow pack for both current and legacy Boxed Intel® Desktop and Server processors over the next few months. After that, the syringe-based thermal interface material will be phased out in favor of the pillow pack version.

This part may be ordered online here.
- You also can order thermal interface material replacement kits through Intel® Customer Support. The Intel® part number is D54816-001 for the syringe and E94211-001 or G15816-001 for the pillow pack.
- What's the difference between E94211-001 & G15816-001?
- E94211-001 will be included in some box processors that have a fan/heatsink without the pre-applied TIM. G15816-001 is stocked as an individual packet with instructions. The TIM in both instances is the same.
- You should apply all of the TIM to the center of the Integrated Heat Spreader (IHS), which is the metal plate on the top of the processor. It will spread out when the heatsink is installed on top of it and flow when the processor reaches its normal operating temperature.
Below are the steps you should follow during the thermal interface material reinstallation process.
Thermal Interface Material Installation (Thermal Grease TC-1996)
| STEP 1 |
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Important: Ensure processor and heatsink bonding surfaces are free from previously applied thermal interface material, oil, dust, and any other debris.
Do not add new thermal grease on top of the existing of old grease. TIM is not reusable and previous Thermal Interface Material should be completely removed.
Do not place a sticker or any other material on top of the processor Integrated Heat Spreader (IHS). Only Thermal Interface Material (TIM) should be used between the processor IHS and the heat sink. Using any other material will degrade the thermal transfer characteristics and could potentially damage the processor (causing the warranty to be voided).
Never touch the thermal interface material as any foreign substances (such as oils from your skin, or chemicals) can reduce the effectiveness of the thermal contact. Thermal grease is very prone to smudging and must not be touched. |
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Wipe off previously applied/used TIM on the heatspreader with a soft, dry cloth or tissue. |
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Be careful not to touch the gold contacts at the bottom of the CPU. |
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Install the processor in the socket. | |
| STEP 2 |
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This part is for adding TIM on IHS because you did not have any Thermal Interface Material on your heatsink or you removed it and need to reinstall TIM.
Remove the syringe from the protective plastic covering. |
| STEP 3 |

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Preparing the Syringe Open the tip of the syringe by twisting off cap.
OR
Preparing the Pillow Pack Cut the package on the dotted black line.
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| STEP 4 |

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Syringe Application Inject the thermal grease from the syringe to the center of the Integrated Heat Spreader surface.
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Pillow Pack Application Push/dispense the thermal material from the package to the center of the processor surface. Note: There will be some residue left in the package after installation. |
| STEP 5 |
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Install the heat sink.
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This applies to:
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