Thermal Solution Considerations

The Boxed Intel® Pentium® 4 Processor in the 478-pin package includes a thermal solution to ensure adequate cooling of your processor. The thermal solution also provides increased shock and vibration protection during normal shipping and handling of the assembled system.

To provide this protection, the thermal solution provides controlled compression on the processor and socket. This compression results in curvature in the motherboard. Therefore, to ensure proper installation and maximum reliability:

  1. It is normal to observe a bow or bend in the motherboard. The level of bow or bend depends on the motherboard material properties and component layout. Heatsinks delivered with Boxed Intel® Processors are designed for use only with the clip included with this solution. The Boxed Intel® Pentium® 4 Processor should be installed after the motherboard has been secured in the chassis. More information is located in the document entitled, "Assembling Intel Reference Components for the Pentium® 4 Processor in the 478-Pin Package".
  2. Intel recommends that system integrators select only chassis with a minimum clearance of 0.250" [6.35mm] between the underside of the motherboard and the bottom of the chassis in order to guard against contact between the motherboard and the chassis.
  3. Do not use additional board stiffening devices (typically installed underneath the motherboard) with this thermal solution. Stiffening devices may significantly increase the compression and cause permanent damage to the processor or the board.
  4. In some instances, the clip that attaches the fan and heatsink to the processor will not stay closed. The gray levers may pop up or may even come out of the clip completely. The fan may not spin when the levers are pushed down because the clip blocks the fan blades.

Related topic:
Installation and integration of 478 pin socket processors

This applies to:

Intel® Pentium® 4 Processor Extreme Edition
Intel® Pentium® 4 Processors

Solution ID: CS-030175
Last Modified: 09-Oct-2014
Date Created: 04-Feb-2009
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