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Symptom(s):
- 478-pin package
- Current Thermal Interface Material is worn
Solution:
Shin-Etsu Thermal* G-749 or Dow Corning TC-1996* Thermal Conductive Compound can be used in conjunction with the Intel® Boxed Processor thermal solution provided with the Boxed Pentium® 4 and Boxed Celeron® processors in the 478-pin FC-PGA2 package. Before applying the thermal grease or compound, the remaining thermal interface material should be thoroughly cleaned off. The black interface patch can be peeled off when cold, however the remainder of the material should be completely removed. A solvent/degreasant can be used along with a soft cloth to ensure that the bottom of the heat sink is not scratched in the process.
If the black interface material is not thoroughly removed prior to re-applying the new grease, the thermal resistance is increased and the fan heat sink will not dissipate the heat sufficiently.
Instructions for applying the thermal grease:
Apply all of the thermal interface material in the syringe to the center of the processor's integrated heat spreader. Center the fan heatsink over the socket and retention mechanism assembly and allow the heatsink base to compress the thermal interface material over the surface of the processor's integrated heat spreader.
Follow the remaining integration steps as outlined here:
Integration Overview for Systems Based On The Boxed Pentium® 4 Processor In The 478-Pin Package
Shin-Etsu* G-749, part number # A34404-001 or
Dow Corning TC-1996* Thermal Conductive Compound, part number # D54816-001 can be ordered from Intel Customer Technical Support
Shin-Etsu* G-749, part number # A34404-001 is being replaced by Dow Corning TC-1996* Thermal Conductive Compound, part number # D54816-001 in our Depots.
This applies to:
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