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Solution:
The thermal/mechanical solution for the boxed Pentium® 4 and Celeron® processors in the 478-pin package is designed to place a compressive load on the CPU package and socket. It is normal to observe a bow or bend in the motherboard. The level of bow or bend depends on the motherboard material properties and component layout. Heatsinks delivered with boxed Intel® processors are designed for use only with the clip included with this solution. The boxed processor should be installed after the motherboard has been secured in the chassis. More information is located in the document entitled, "Assembling Intel Reference Components for the Pentium 4 Processor in the 478-Pin Package"
Details:
The thermal and mechanical retention solution for the boxed Pentium 4 processor in 478-pin package does not require direct attachment to the chassis, unlike the 423-pin package. Instead, the boxed processor thermal/mechanical solution provides for the following:
- Motherboard stiffening to protect socket and chipset solder joints during manufacturing and shipment
- Prevention of package pullout during shipment
- Assurance of thermal interface material performance
This solution can be mounted entirely from the topside of the motherboard, and has no specific tool requirements. In addition, this solution increases the motherboard design flexibility, and enables the processor/motherboard combination to be chassis-independent (although proper thermal validation should be conducted, as always). The boxed processor should be installed after the motherboard has been secured in the chassis. By using the motherboard's rigidity to its advantage, the thermal/mechanical solution is designed to provide structural robustness to ensure mechanical and electrical integrity of the motherboard during shock and vibration events. It does this by placing a compressive pre-load on the CPU package and socket. Heatsinks delivered with boxed Intel processors are designed for use only with the clip included with this solution, as available clip and heatsink designs are not necessarily interchangeable.
When the thermal/mechanical solution for the boxed Pentium 4 and Celeron® processors in the 478-pin package is installed in the motherboard, it is normal to observe a bow or bend in the motherboard. The level of bow or bend depends on the motherboard material properties and component layout. Testing of the boxed processor thermal/mechanical solution in Intel® Desktop boards has yielded no quality or reliability concerns.
This applies to:
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