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Symptom(s):
Solution:
Do not use board stiffening devices (found on some non-Intel motherboards), such as stiffening plates, when installing a boxed Pentium® 4 processor in the 478-pin package. Using such devices will likely damage the processor and socket, and may cause improper operation of the heatsink fan. Use only the clip and heatsink that came with the boxed processor, and the retention mechanism attached to the motherboard. If your motherboard comes with a stiffening plate installed (typically on the underside of the motherboard), please remove it before installing the boxed Pentium 4 processor. The thermal/mechanical solution for the boxed Pentium 4 processor in the 478-pin package is designed to place a specific compressive load on the CPU package and socket. It is normal to observe a bow or bend in the board. The level of bow or bend depends on the motherboard material properties and component layout. Integrators should take care to select a chassis that has adequate clearance between the motherboard and chassis wall (minimum 0.250") to ensure component leads on the board do not contact the chassis. More information on the proper installation of the boxed Pentium 4 processor in 478-pin package can be found in the document entitled, Assembling Intel Reference Components for the Pentium 4 Processor in the 478-Pin Package".
Details:
When the thermal/mechanical solution for the boxed Pentium 4 processor in the 478-pin package is installed in the motherboard, it is normal to observe a bow or bend in the board. The level of bow or bend depends on the motherboard material properties and component layout. By using the motherboard's rigidity to its advantage, the thermal/mechanical solution is designed to provide structural robustness to ensure mechanical and electrical integrity of the motherboard during shock and vibration events. It does this by placing a specific compressive pre-load on the CPU package and socket. Testing of the boxed processor thermal/mechanical solution in Intel desktop boards has yielded no quality or reliability concerns caused by board bending.
Any additional board stiffening devices are not necessary and should not be used. These include stiffening plates that install or are pre-installed on the underside of some non-Intel motherboards. Using such devices increases the compressive load on the processor package and socket, likely beyond the maximum load that is specified for those components. In addition, the processor's fan heatsink clip may be difficult or impossible to install correctly, potentially causing fan failure and improper operation, which would void the processor warranty. If your motherboard comes with a stiffening plate installed, please remove it before installing the boxed Pentium 4 processor. Use only the clip and heatsink that came with the boxed processor, and the retention mechanism attached to the motherboard.
Integrators should take care to select chassis that have adequate clearance between the motherboard and chassis wall (minimum 0.250 inch) to ensure the board's underside bend does not contact the chassis.
This applies to:
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