Processors
Intel® Pentium® Processor
Packing Identification Codes

The following is a list of all the different package types that are currently being used on all Intel products. The package types are the prefixes for all of the ordering codes. These order codes are for the commercial components only!!

Package Type
A - Ceramic Pin Grid Array
B - Ceramic Land Grid Array
C - Ceramic Dual In-Line Package
D - Cerdip Dual In-Line Package
DP - Cerdip Dual In-Line Package, 300 ML
E - Thin Small Out-Line Package, Die Up
F - Thin Small Out-Line Package, Die Down
FP - Plastic Flatpack Package
GB - Single In-Line Leaded Memory Module
J - Cerquad Package
K - Ceramic Quad Flatpack Package, Fine Pitch, Flat Leads
KD - Plastic Quad Flatpack Package, Fine Pitch, Die Down
KU - Plastic Quad Flatpack Package, Fine Pitch, Die Up
N - Plastic Leaded Chip Carrier
NG - Plastic Quad Flatpack, Fine Pitch, Die Down w/ Heat Spreader
P - Plastic Dual In-Line Package
PA - Small Out-Line "Gull-Wing" Package
PD - Plastic Dual In-Line Package, 300ML
PE - Small Out-Line "J" Lead Package
Q - Ceramic Quad Flatpack Package
R - Ceramic Leadless Chip Carrier
S - Quad Flatpack Package
SB - Shrink Quad Flatpack Package
SM - Single In-Line Leadless Memory Module
U - Plastic Dual In-Line Package, Shrink Dip
X - Unpackaged Devices
Z - ZigZag In-Line Package
A - Indicates Automotive Operating Temperature Range
I - Indicates Industrial Grade
L - Indicates extended operating temperature range (-400C to +850C) express product with 1608 hrs. dynamic burn-in.
Q - Indicates commercial temperature range (00C to +700C) express product with 1608 hrs. dynamic burn-in.
T - Indicates extended operating temperature range (-400C to +850C) express product without burn-in.

Below there is a package designator illustration and description of all of the above mentioned package types.

Package descriptions
Commercial components

PACKAGE
DESIGNATOR
ILLUSTRATION
DESCRIPTION
CQFP

(Formed Lead)
CERAMIC QUAD FLAT PACK (KK)

An aluminum ceramic integrated circuit package with four sets of leads extending from the sides and parallel to the base. Can be surface or socked mounted. Fixed lead pitch of .025"e;.

LCC
(Bottom View)
LEADLESS CHIP CARRIER ®

An integrated ceramic circuit package that allows surface mounting of components directly into the substrate by means of solden joints. Can be socket or surface mounted. Fixed lead pitch of .050"e; leaded or leadless.

P-FP
PLASTIC FLAT PACK (FP)

A plastic integrated circuit package whose leads extend from the sides and are parallel to the base. Package can be surface mounted or bent for insertion. Fixed lead pitch is 0.50"e;.

SIMM
SINGLE IN-LINE LEADLESS MEMORY (SM)

A module that features a vertical body with a fixed lead pitch of .100"e;. SIMM can be socket mounted.

PQFP
PLASTIC QUAD FLAT PACK (KU, KD, NG)

A Fine Pitch (0.025"e;) Plastic Surface Mount package with gull-wing formed leads. PQFP is available in variable body sizes and lead counts. This package also has a bumper on each corner to protect the leads.

QFP
QUAD FLAT PACK (S)

An (EIAJ) Plastic Surface Mount package with gull-wing formed leads. QFP's are available in various lead counts and lead pitch. QFP's have no corner bumpers.

SIP
SINGLE IN-LINE LEADED MEMORY MODULE (GB)

A module that features a vertical body with leads extending from the bottom of the package for socket or insertion mount. The SIP has fixed leadpitch of .100"e;.

SOJ
SMALL OUTLINE WITH J-LEADS (PE)

A small outline package with J-Leads. The SOJ is a surface mount package with a fixed lead pitch of .050"e;.

SOP
SMALL OUTLINE PACKAGE (PA)

A small outline package with gull wing formed leads. The SOP is a surface mount package with a fixed lead pitch of .050"e;.

TSOP
THIN SMALL OUTLINE PACKAGE (E, F) A plastic surface mount memory package that features 0.5MM pitch gull-wing leads on two sides of the package.
ZIP
ZIG ZAG IN-LINE PACKAGE (Z) A variation of a single in-line package with a lead pitch of .05 inches, whose leads are bent to alternate sides, forming 2 rows, each with a 0.1 in. pitch. The Zip package can be either socket or insertion mounted.
LGA
LAND GRID ARRAY (B) A ceramic multi-layer package with array of lands on the bottom side of the package. LGA's are available in variable body sizes and land/lead pitch. LGA's are socket mount only. Socket required.
  SHRINK DIP (U)

A plastic dual in-line package with a fixed lead pitch of .070"e;. Shrink Dip has leads extending from two sides, bent to form two rows of leads. Can be either socket or insertion.

This applies to:

Intel® Pentium® Processor



Solution ID: CS-011035
Last Modified: 06-Oct-2014
Date Created: 12-May-2004
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