Mobile Pentium® processors are available in the following packages: Plastic Pin Grid Array (PPGA), Staggered Pin Grid Array (SPGA), and Tape Carrier Packages (TCP).
The Intel Packaging Databook provides a comprehensive and in-depth analysis of Intel's packaging technology, including information on IC assembly, performance characteristics, and physical constants. There are also detailed discussions of surface mount technology and Intel shipping and packing.
Module packaging information
Mechanical dimensions are outlined in the Mechanical Requirement section of the following datasheets:
This applies to: