The foam air bypass pad and skirt should not be installed with Intel® integrated server systems. Intel® integrated server systems are an Intel® Server Board and Intel® Chassis combination.
The installation instructions included with your boxed Intel® Xeon® Processor show the application of two foam pads (top pad and skirt) to the heatsink.
See the image below:
The instruction step above is intended for use with non Intel solutions that require the foam pads to facilitate proper airflow for correct processor thermal cooling.
Intel integrated server systems are designed to provide correct airflow through the processor heatsink without the use of the two foam pads.
The foam pads shipped with various SKUs of boxed Intel® Xeon® Processors are included as a courtesy to customers that may need it in order to decrease potential air bypass when using our thermal solution in a non Intel solution 1U rack configuration.
The foam pad use is strictly up to the discretion of system integrators that may need them to improve the thermal performance of their 1U non Intel solution systems to block off any potential air bypass of the heatsink. One pad can be applied to the top of the heatsink to block any bypass between the top of the heatsink and the top of the 1U rack chassis while the skirt is used to block any potential bypass under the heatsink and around the socket.
This applies to: