Desktop Boards
Intel® Desktop Board D915GAV
System Memory

System memory features
The boards have four DIMM sockets and support the following memory features:

  • 2.6V (only) DDR SDRAM DIMMs with gold-plated contacts.
  • Unbuffered, single-sided or double-sided, DIMMs with the following restriction: Double-sided DIMMs with x16 organization are not supported.
  • 4 GB maximum total system memory.
  • Minimum total system memory: 128 MB.
  • Non-ECC DIMMs.
  • Serial Presence Detect.
  • DDR 400 MHz and DDR 333 MHz SDRAM DIMMs.
Notes
  • Remove the PCI Express* x16 video card before installing or upgrading memory to avoid interference with the memory retention mechanism.
  • To be fully compliant with all applicable DDR SDRAM memory specifications, the board should have DIMMs supporting the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS tries to correctly configure the memory settings, but performance and reliability can be impacted or the DIMMs might not function under the designated frequency.

Supported system bus frequency and memory speed combinations

To use this type of DIMM: The processor system Bus frequency must be:
DDR400 800 MHz
DDR333(Note) 800 or 533 MHz

Note When using an 800 MHz system Bus frequency processor, DDR 333 memory is clocked at 320 MHz. This minimizes system latencies to optimize system throughput.

Supported memory configurations

DIMM Capacity Configuration SDRAM Density SDRAM Organization
Front-side/Back-side
Number of
SDRAM Devices
128 MB SS 256 Mbit 16 M x 16/empty 4
256 MB SS 256 Mbit 32 M x 8/empty 8
256 MB SS 512 Mbit 32 M x 16/empty 4
512 MB DS 256 Mbit 32 M x 8/32 M x 8 16
512 MB SS 512 Mbit 64 M x 8/empty 8
512 MB SS 1 Gbit 64 M x 16/empty 4
1024 MB DS 512 Mbit 64 M x 8/64 M x 8 16
1024 MB SS 1 Gbit 128 M x 8/empty 8
2048 MB DS 1 Gbit 128 M x 8/128 M x 8 16

Note In the second column, "DS" stands for double-sided memory modules (two rows of SDRAM) and "SS" stands for single-sided memory modules (one row of SDRAM).

Tested memory

Third-party tested memory*
Third-party tested memory occurs as requested by the memory vendors and is tested at an independent memory house that is not a part of Intel. Memory tested is by Computer Memory Test Labs* (CMTL).

Vendor self tested memory
Intel supplies the memory vendors that participate in this program with a common memory test plan to use as a basic checkout of the memory stability. Memory listed here is tested either by the memory vendor or by Intel using this test plan. These part numbers might not be readily available throughout the product life cycle.

The table below lists parts that passed testing conducted using the Intel Self Test program for Intel® Desktop Board D915GAV.

Module Supplier
Module Part Number
Module Size
(MB)
Module Speed
(MHz)
Latency
CL-tRCD-tRP
ECC or
Non-ECC?
DIMM
Organi-zation
Module
Date Code
Component Used
Comp Part Number
A-DATA*
MDOEL6F3G31Y0D1E0Z
256 MB 400 3-4-4 Non-ECC SSx8 0527 Elpida*
DDR-DD2508ARTA
A-DATA
MDOHY6F3G3X10BZE0Z
256 MB 400 3-3-3 Non-ECC SSx8 510A Hynix*
DDR-HY5DU56822DT-D43
Infineon Technologies*
HYS64D128320HU-5-B
1 GB 400 3-3-3 Non-ECC DSx8 0445 Infineon Technologies
HYB25D512800BE-5
Infineon Technologies
HYS64D64320HU-5-C
512 MB 400 3-3-3 Non-ECC DSx8 0436 Infineon Technologies
HYB25D512800CE-5
Infineon Technologies
HYS64D32300HU-5-C
256 MB 400 3-3-3 Non-ECC SSx8 0432 Infineon Technologies
HYB25D512800CE-5
Kingston Technology*
KVR400X64C3A/1G
1 GB 400 3-3-3 Non-ECC DSx8 0518 Infineon
HYB25D512800BE-5
Kingston Technology
KVR400X64C3A/1G
1 GB 400 3-3-3 Non-ECC DSx8 449 Samsung*
K4H510838B-TCCC
Kingston Technology
KVR400X64C3A/512
512 MB 400 3-3-3 Non-ECC SSx8 0518 Micron*
MT46V64M8-5B
Kingston Technology
KVR400X64C3A/512
512 MB 400 3-3-3 Non-ECC DSx8 0000 Samsung*
K4H560838F-TCCC
Kingston Technology
KVR400X64C3A/256
256 MB 400 3-3-3 Non-ECC SSx8 0000 Promos*
V58C2256804SCT5B
Micron*
MT16VDDT12864AY-40BD3
1024 MB 400 3-3-3 Non-ECC DSx8 0528 Micron
MT46V64M8P
Micron
MT16VDDF6464AY-40BG1
512 MB 400 3-3-3 Non-ECC DSx8 0540 Micron
MT46V32M8BG
Micron
MT8VDDT6464AG-40BD1
512 MB 400 3-3-3 Non-ECC SSx8 0534 Micron
MT46V64M8TG
Micron
MT16VDDT6464AG-40BG6
512 MB 400 3-3-3 Non-ECC DSx8 0536 Micron
MT46V32M8TG
Micron
MT16VDDT6464AY-40BG6
512 MB 400 3-3-3 Non-ECC DSx8 0534 Micron
MT46V32M8P
Micron
MT16VDDT6464AG-40BG4
512 MB 400 3-3-3 Non-ECC DSx8 0508 Micron
MT46V32M8TG
Micron
MT16VDDT6464AG-40BG5
512 MB 400 3-3-3 Non-ECC DSx8 0535 Micron
MT46V32M8TG
Micron
MT8VDDT6464AG-40BD3
512 MB 400 3-3-3 Non-ECC SSx8 0523 Micron
MT46V64M8TG
Micron
MT8VDDT6464AY-40BD3
512 MB 400 3-3-3 Non-ECC SSx8 0534 Micron
MT46V64M8P
Micron
MT8VDDT3264AG-40BG6
256 MB 400 3-3-3 Non-ECC SSx8 0536 Micron
MT46V32M8TG
Micron
MT8VDDT3264AG-40BG5
256 MB 400 3-3-3 Non-ECC SSx8 0533 Micron
MT46V32M8TG
Micron
MT8VDDF3264AY-40BG1
256 MB 400 3-3-3 Non-ECC SSx8 0540 Micron
MT46V32M8BG
Samsung*
M368L2923DUN-CCC
1 GB 400 3-3-3 Non-ECC DSx8 0540 Samsung
K4H510838D-UCCC
Samsung
M368L2923CUN-CCC
1 GB 400 3-3-3 Non-ECC DSx8 0509 Samsung
K4H510838C-UCCC
Samsung
M368L6523DUD-CCC
512 MB 400 3-3-3 Non-ECC SSx8 0549 Samsung
K4H510838D-UCCC
Samsung
M368L6423ETN-CCC
512 MB 400 3-3-3 Non-ECC DSx8 0509 Samsung
K4H560838E-TCCC
Samsung
M368L6423FTN-CCC
512 MB 400 3-3-3 Non-ECC DSx8 0506 Samsung
K4H560838F-TCCC
Samsung
M368L6523CUS-CCC
512 MB 400 3-3-3 Non-ECC SSx8 0503 Samsung
K4H510838C-UCCC
Samsung
M368L3223FTN-CCC
256 MB 400 3-3-3 Non-ECC SSx8 0506 Samsung
K4H560838F-TCCC
Samsung
M368L3324CUS-CCC
256 MB 400 3-3-3 Non-ECC SSx16 0506 Samsung
K4H511638C-UCCC
Samsung
M368L3223ETN-CCC
256 MB 400 3-3-3 Non-ECC SSx8 0506 Samsung
K4H560838E-TCCC
Infineon Technologies
HYS64D128320HU-6-B
1 GB 333 2.5-3-3 Non-ECC DSx8 0434 Infineon Technologies
HYB25D512800BE-6
Infineon Technologies
HYS64D64320HU-6-C
512 MB 333 2.5-3-3 Non-ECC DSx8 0436 Infineon Technologies
HYB25D512800CE-6
Infineon Technologies
HYS64D32300HU-6-C
256 MB 333 2.5-3-3 Non-ECC SSx8 0436 Infineon Technologies
HYB25D512800CE-6
Micron
MT16VDDT12864AG-335D1
1024 MB 333 2.5-3-3 Non-ECC DSx8 0537 Micron
MT46V64M8TG
Micron
MT8VDDT6464AG-335D3
512 MB 333 2.5-3-3 Non-ECC SSx8 0513 Micron
MT46V64M8TG
Micron
MT8VDDT6464AG-335D2
512 MB 333 2.5-3-3 Non-ECC SSx8 0505 Micron
MT46V64M8TG
Micron
MT8VDDT6464AG-335D1
512 MB 333 2.5-3-3 Non-ECC SSx8 0450 Micron
MT46V64M8TG
Micron
MT16VDDT6464AG-335G4
512 MB 333 2.5-3-3 Non-ECC DSx8 0408 Micron
MT46V32M8TG
Micron
MT8VDDT3264AG-33G4
256 MB 333 2.5-3-3 Non-ECC SSx8 0540 Micron
MT46V32M8TG
Micron
MT8VDDT3264AG-335G4
256 MB 333 2.5-3-3 Non-ECC SSx8 0450 Micron
MT46V32M8TG
Micron
MT8VDDT3264AG-335G6
256 MB 333 2.5-3-3 Non-ECC SSx8 0513 Micron
MT46V32M8TG
Samsung
M368L5623MTN-CB3
2 GB 333 2.5-3-3 Non-ECC DSx8 0508 Samsung
K4H1G0838M-TCB3

This applies to:

Intel® Desktop Board D915GAV



Solution ID: CS-027070
Last Modified: 13-Oct-2014
Date Created: 13-Jun-2007
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