Desktop Boards
Intel® Desktop Board D910GLDW
System Memory

System memory features
The board has two DIMM sockets and supports the following memory features:

  • 2.6 V (only) DDR SDRAM DIMMs with gold-plated contacts.
  • Unbuffered, single-sided or double-sided DIMMs with the following restriction: Double-sided DIMMs with x16 organization are not supported.
  • 2 GB maximum total system memory.
  • Minimum total system memory: 128 MB.
  • Non-ECC DIMMs.
  • Serial Presence Detect.
  • DDR 400 MHz and DDR 333 MHz SDRAM DIMMs.

Note:
To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the DIMMs may not function under the determined frequency.

Supported DIMM configurations

DIMM Capacity Configuration SDRAM Density SDRAM Organization Front-side/Back-side Number of SDRAM Devices
128 MB SS 256 Mbit 16 M x 16/empty 4
256 MB SS 256 Mbit 32 M x 8/empty 8
256 MB SS 512 Mbit 32 M x 16/empty 4
512 MB DS 256 Mbit 32 M x 8/32 M x 8 16
512 MB SS 512 Mbit 64 M x 8/empty 8
512 MB SS 1 Gbit 64 M x 16/empty 4
1024 MB DS 512 Mbit 64 M x 8/64 M x 8 16
1024 MB SS 1 Gbit 128 M x 8/empty 8
2048 MB DS 1 Gbit 128 M x 8/128 M x 8 16

Note:
In the second column, "DS" refers to double-sided memory modules (containing two rows of DDR SDRAM) and "SS" refers to single-sided memory modules (containing one row of DDR SDRAM).

Tested memory

Vendor self tested memory
Intel supplies the memory vendors that participate in this program with a common memory test plan to use as a basic checkout of the memory stability. Memory listed here was either tested by the memory vendor or by Intel using this test plan. These part numbers may not be readily available throughout the product life cycle.

The table below lists parts which passed testing conducted using Intel's Self Test program for Intel® Desktop Board D910GLDW.

Module Supplier
Module Part Number
Module Size
(MB)
Module Speed
(MHz)
Latency
CL-tRCD-tRP
ECC or
Non-ECC?
DIMM
Organization
Module
Date Code
Component Used
Comp Part Number
Infineon Technologies*
HYS64D128320HU-5-B
1GB 400 3-3-3 Non-ECC DSx8 0445 Infineon Technologies
HYB25D512800BE-5
Infineon Technologies
HYS64D64320HU-5-C
512MB 400 3-3-3 Non-ECC DSx8 0436 Infineon Technologies
HYB25D512800CE-5
Infineon Technologies
HYS64D32300HU-5-C
256MB 400 3-3-3 Non-ECC SSx8 0432 Infineon Technologies
HYB25D512800CE-5
Kingston Technology*
KVR400X64C3A/1G
1 GB 400 3-3-3 Non-ECC DSx8 0518 Infineon
HYB25D512800BE-5
Kingston Technology
KVR400X64C3A/1G
1 GB 400 3-3-3 Non-ECC DSx8 449 Samsung*
K4H510838B-TCCC
Kingston Technology
KVR400X64C3A/512
512 MB 400 3-3-3 Non-ECC SSx8 0518 Micron*
MT46V64M8-5B
Kingston Technology
KVR400X64C3A/512
512MB 400 3-3-3 Non-ECC DSx8 0000 Samsung
K4H560838F-TCCC
Kingston Technology
KVR400X64C3A/256
256MB 400 3-3-3 Non-ECC SSx8 0000 Promos*
V58C2256804SCT5B
Samsung
M368L2923CUN-CCC
1 GB 400 3-3-3 Non-ECC DSx8 0509 Samsung
K4H510838C-UCCC
Samsung
M368L6423ETN-CCC
512 MB 400 3-3-3 Non-ECC DSx8 0509 Samsung
K4H560838E-TCCC
Samsung
M368L6423FTN-CCC
512 MB 400 3-3-3 Non-ECC DSx8 0506 Samsung
K4H560838F-TCCC
Samsung
M368L6523CUS-CCC
512 MB 400 3-3-3 Non-ECC SSx8 0503 Samsung
K4H510838C-UCCC
Samsung
M368L3223FTN-CCC
256 MB 400 3-3-3 Non-ECC SSx8 0506 Samsung
K4H560838F-TCCC
Samsung
M368L3324CUS-CCC
256 MB 400 3-3-3 Non-ECC SSx16 0506 Samsung
K4H511638C-UCCC
Samsung
M368L3223ETN-CCC
256 MB 400 3-3-3 Non-ECC SSx8 0506 Samsung
K4H560838E-TCCC
Infineon Technologies
HYS64D128320HU-6-B
1GB 333 2.5-3-3 Non-ECC DSx8 0434 Infineon Technologies
HYB25D512800BE-6
Infineon Technologies
HYS64D64320HU-6-C
512MB 333 2.5-3-3 Non-ECC DSx8 0436 Infineon Technologies
HYB25D512800CE-6
Infineon Technologies
HYS64D32300HU-6-C
256MB 333 2.5-3-3 Non-ECC SSx8 0436 Infineon Technologies
HYB25D512800CE-6
Micron
MT16VDDT6464AG-40BGB
512MB 400 3-3-3 Non-ECC DBx16 0511 Micron
MT46V32M8TG
Micron
MT16VDDT12864AG-335DB
1024MB 333 2.5-3-3 Non-ECC DBx8 0519 Micron
MT46V64M8TG
Micron
MT16VDDT12864AY-335DB
1024MB 333 2.5-3-3 Non-ECC DBx8 0438 Micron
MT46V64M8P
Samsung
M368L5623MTN-CB3
2 GB 333 2.5-3-3 Non-ECC DSx8 0508 Samsung
K4H1G0838M-TCB3

Updated: September 6, 2005

This applies to:

Intel® Desktop Board D910GLDW



Solution ID: CS-027105
Last Modified: 13-Oct-2014
Date Created: 14-Jun-2007
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