Memory testing has been performed under the following categories:
Advanced Tested Memory*
Intel provides the Advanced environmental test procedures, test software and necessary hardware to an independent test lab to perform Advanced testing as requested by the memory vendors. Memory tested by Computer Memory Test Labs (CMTL).
Intel Internal Tested Memory
Intel's has a limited amount of memory tested for the desktop board. These part numbers may not be readily available throughout the product life cycle.
System Memory Features
The 82850E MCH integrates two lock-stepped Direct Rambus banks, providing a processor-to-memory bandwidth up to 4.3 GB/sec**. The desktop board D850EMV2 has four RIMM sockets (two sockets for each bank) and support the following memory features:
- Single- or double-sided RIMM configurations
- Maximum of 24 Direct Rambus PC1066-32P devices**
- Memory configurations up to 1.5 GB, using 256 Mbit technology PC1066-compliant RDRAM**
- Maximum of 32 Direct Rambus devices
- Memory configurations up to 2 GB, using 128 Mbit or 256 Mbit technology PC800-compliant RDRAM
- Serial Presence Detect (SPD)-based configuration for optimal memory operation
- Suspend to RAM (S3) support
- ECC and non-ECC support
||PC1066 support is only available on D850EMVR desktop boards (AA#'s C18369-603 & C18361-602 or later).|
Continuity RIMM Modules
All RIMM sockets must be populated to achieve continuity for termination at the Rambus interface. Continuity RIMMs (or "pass-through" modules) must be installed in the second RDRAM bank if memory is not installed. If any of the RIMM sockets are not populated, the computer will not complete the Power-On Self-Test (POST) and the BIOS beep codes will not be heard.
RDRAM Memory Configuration
When installing memory, note the following:
Bank 0 must be populated first, ensuring that the RDRAM installed in RIMM1 and RIMM2 is identical in speed, size, and density. For example, the minimum system configuration would use two 64 MB RIMM modules of PC800 RDRAM.
If the desired memory configuration has been achieved by populating Bank 0, then Bank 1 should be filled with two Continuity RIMMs.
If memory is to be installed in Bank 1, the RIMM modules installed in RIMM3 and RIMM4 must be identical in size and density to each other and match the speed of the RIMM modules in Bank 0. The RIMM modules do not, however, need to match those in Bank 0 in size and density. For example, if Bank 0 has two 128 MB RIMMs of PC800 RDRAM, Bank 1 would require PC800 RDRAM also; however, any other supported RIMM modules such as 64 MB or 192 MB could be used.
If ECC functionality is required, all installed RIMM modules must be ECC compliant. The following table gives examples of RDRAM component density for various RIMM modules. Component density (counts) can be identified on the RIMM label.
- The four RIMM sockets are grouped into two banks:
- Bank 0 (labeled on the board as RIMM1 and RIMM2)
- Bank 1 (labeled on the board as RIMM3 and RIMM4)
Supported Memory Configurations
||Capacity with 4 DRAM Components per RIMM
||Capacity with 6 DRAM Components per RIMM
||Capacity with 8 DRAM Components per RIMM
||Capacity with 12 DRAM Components per RIMM
||Capacity with 16 DRAM Components per RIMM|
|128/144 Mbit, -40
|256/288 Mbit, -40
This applies to: