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System Memory Features
The board has four FB-DIMM sockets and supports the following memory features:
- Four 240-pin DDR2 SDRAM FBDIMM sockets with gold-plated contacts
- 800/667 MHz DDR2 SDRAM interface
- DIMM cooling fan header
- 800/667 MHz Fully Buffered DDR2 DIMMs only
- Up to 4 GB utilizing 512 Mb or 1 Gb technology
- Up to 16 GB utilizing 1 Gb technology
- Serial Presence Detect (SPD) memory only
Notes:
To be fully compliant with all applicable Intel® SDRAM memory specifications, the board should be populated with FBDIMMs that support the Serial Presence Detect (SPD) data structure. If your memory modules do not support SPD, you will see a notification to this effect on the screen at power up. The BIOS will attempt to configure the memory controller for normal operation.
A DIMM cooling fan is recommended for use on Intel® Desktop Board D5400XS. A DIMM cooling fan is not included and must be purchased separately.
Memory Population Rules:
Please refer to the Configuration Label to see which DIMM corresponds to which Branch and Channels listed below:
| Memory Socket Location |
Assignment |
| DIMM A |
Memory Branch 0 Channel 0 |
| DIMM B |
Memory Branch 0 Channel 1 |
| DIMM C |
Memory Branch 1 Channel 0 |
| DIMM D |
Memory Branch 1 Channel 1 | |
- DIMM population rules are governed by the chipset. The MCH provides four channels of Fully Buffered DIMM (FBD) memory in 2 branches. Channels within a branch share the device IDs and control registers.
- Within a Branch, both Channels must have identical DIMMs (speed, size, timings) or only the first Channel will be seen.
- 3 DIMM population is not supported. Only the DIMM(s) in Branch 1 will be seen.
- Using all identical DIMMs is strongly preferred.
Supported DIMM Configurations
| DIMM Capacity |
Configuration (Note 1) |
SDRAM Density |
SDRAM Organization Front-side/Back-side |
Number of SDRAM Devices (Note 2) |
| 512 MB |
SS |
512 Mbit |
64 M x 8 / Empty |
8 [9] |
| 512 MB |
SS |
1 Gbit |
64 M x 16 / Empty |
4 [5] |
| 1 GB |
DS |
512 Mbit |
64 M x 8 / 64 M x 8 |
16 [18] |
| 1 GB |
SS |
1 Gbit |
128 M x 8 / Empty |
8 [9] |
| 2 GB |
DS |
1 Gbit |
128 M x 8 / 128 M x 8 |
16 [18] |
| 4 GB |
DS |
1 Gbit |
256 M x 4 |
36 [40] |
| 4 GB |
SS |
2 Gbit |
512 M x 4 |
16 [18] | |
Notes 1. In the second column, “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to single-sided memory modules (containing one row of SDRAM). 2. In the fifth column, the number in brackets specifies the number of SDRAM devices on an ECC DIMM.
Tested Memory
3rd Party Tested Memory* 3rd party tested memory occurs as requested by the memory vendors and is tested at an independent memory house that is not a part of Intel - Computer Memory Test Labs (CMTL).
Vendor Self Tested Memory Intel supplies the memory vendors that participate in this program with a common memory test plan to use as a basic checkout of the memory stability. Memory listed here was either tested by the memory vendor or by Intel using this test plan. These part numbers may not be readily available throughout the product life cycle.
The table below lists parts which passed testing conducted using Intel's Self Test program for Intel® Desktop Board D5400XS. For a complete explanation of the self test see the Desktop Board Component Functional Testing Levels page.
| Module Supplier / Module Part Number |
Module Size |
Module Speed |
Ecc or Non-ECC |
DIMM Organization |
| Hynix* HYMP351F72AMP4N3-Y5 |
4 GB |
667 |
ECC |
(256Mx4) x 36 |
| Hynix HYMP512F72CP8D3-Y5 |
1 GB |
667 |
ECC |
(64Mx8) x 18 |
| Hynix HYMP525F72CP4D3-Y5 |
2 GB |
667 |
ECC |
(128Mx4) x 36 |
| Hynix HYMP525F72CP4N3-Y5 |
2 GB |
667 |
ECC |
(128Mx4) x 36 |
| Hynix HYMP512F72CP8N3-Y5 |
1 GB |
667 |
ECC |
(64Mx8) x 18 |
| Kingston* KHX6400F2LLk2/2G |
2 GB |
800 |
Non-ECC |
(128Mx4) x 36 |
| Micron* MT18HTF12872FDY-667D6E4 |
1 GB |
667 |
ECC |
(64Mx8) x 18 |
| Micron MT18HTF25672FY-667E1E4 |
2 GB |
667 |
ECC |
(256Mx4) x 18 |
| Micron MT36HTF51272FY-667E1D4 |
4 GB |
667 |
ECC |
(256Mx4) x 36 |
| Micron MT36HTF51272FY-667E1N6 |
4 GB |
667 |
ECC |
(256Mx4) x 36 |
| Micron MT9HTF12872FY-667E1D4 |
1 GB |
667 |
ECC |
(128Mx8) x 9 |
| Micron MT9HTF12872FY-667E1N6 |
1 GB |
667 |
ECC |
(128Mx8) x 9 |
| Micron MT9HTF6472FY-667D5E4 |
512 MB |
667 |
ECC |
(64Mx8) x 9 |
| Micron MT9HTF6472FY-667D5D4 |
512 MB |
667 |
ECC |
(64Mx8) x 9 |
| Qimonda* HYS72T64400HFN-3S-B |
512 MB |
667 |
ECC |
(64Mx8) x 9 |
| Samsung* M395T5160CZ4-CE66 |
4 GB |
667 |
ECC |
(256Mx4) x 36 |
| Samsung M395T5750EZ4-CE65 |
2 GB |
667 |
ECC |
(128Mx4) x 36 |
| Samsung M395T5750EZ4-CE66 |
2 GB |
667 |
ECC |
(128Mx4) x 36 |
| Samsung M395T6553EZ4-CE66 |
512 MB |
667 |
ECC |
(64Mx8) x 9 |
| Samsung M395T2953EZ4-CE65 |
1 GB |
667 |
ECC |
(64Mx8) x 18 | |
This applies to:
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