Intel® E7525 ChipsetTechnical Documents

Application notes

Intel® E7500 Chipset Family

Intel® E7525 Chipset

Intel® E7520 and E7320 Chipsets

Intel® E7505 Chipset

Intel® E7501 Chipset

Intel® E7500 Chipset Family

Intel® E7525 Chipset

Intel® E7520 and E7320 Chipsets

Intel® E7505 Chipset

Intel® 82870P2 PCI/PCI-X 64-bit Hub 2 (P64H2) Thermal Design Guide: Intel® 82870P2 (P64H2) Thermal and Mechanical Design Guidelines
Intel® E7500/E7501/E7505 Chipset Thermal Design Guide
Intel® E7500/E7505 Chipset Memory Controller Hub (MCH) Thermal and Mechanical Design Guidelines

As the complexity of computer systems increase, so do the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting, and/or passive heatsinks. The goals of this document are: To specify the operating limits of the Intel® E7500/E7501/E7505 chipset MCH components. To describe a reference thermal solution that meets the thermal specifications.

File Type/Size: PDF 588KB
Intel® Xeon® Processor and Intel® E7505 Chipset: For use with Intel® Xeon® Processors with 512-KB L2 Cache and Intel® Xeon® Processors with 533 MHz System Bus Platform Design Guide

This design guide describes Intel’s design recommendations for systems that are based on the Intel® Xeon® processor with 512-KB L2 cache, the Intel® Xeon® processor with 533 MHz system bus, and the Intel® E7505 chipset. The document provides motherboard design recommendations such as layout and routing guidelines, and addresses other system design issues such as power delivery.

File Type/Size: PDF 17318KB

Intel® E7501 Chipset

Intel® E7500 Chipset Family

Intel® E7525 Chipset

Intel® E7520 and E7320 Chipsets

Intel® E7505 Chipset

Intel® E7500 Chipset Family