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Intel® E7525 ChipsetOverview

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Intel® E7525 Memory Controller Hub (MCH) chipset, the next generation Intel® dual-processor (DP) workstation and server chipset technology, offers increased graphics performance, reduced power consumption, and improved platform reliability and system manageability. These new dual-processor workstations deliver outstanding performance, dependability and value to digital content creation, Mechanical Computer Aided Design (MCAD), electronic design automation, and other graphics workstation applications.

Product information

Features and benefits

Supports 2 Intel® Xeon® processors over an 800 MHz system bus for dual-processing workstation and server systems Optimized performance for the DP workstation market segment with a range of price points.
800 MHz system bus capability Increased bus bandwidth (50% greater than 533 MHz) and increased system bandwidth.
Dual-channel DDR2-400
  • Offers a maximum memory bandwidth of 6.4 GB/s.
  • Decreased power consumption—especially important in dense rack, high performance computing (HPC) and blade configurations .
  • Increased DIMMs per system provide enhanced memory scalability for memory-intensive applications.
PCI Express*1 4 X-16 graphics Next generation graphics interface, delivers 4.0 GB/s of graphics bandwidth per direction directly into the Intel® E7525 MCH chipset (total bandwidth 8 GB/s), for twice the bandwidth of AGP 8X.
PCI Express* I/O Serial I/O technology provides a direct connection between the MCH chipset and PCI Express* component/adapters with bandwidth up to 4 GB/s on each PCI Express x8 interface. PCI Express offers higher bandwidth, lower latency and fewer I/O bottlenecks than PCI-X.
Intel® 6700PXH 64-bit PCI Hub
  • Optional component introduces next-generation PCI/PCI-X performance and significant enhancements to platform flexibility.
  • Supports 2 independent 64-bit, 133 MHz PCI-X segments and two Hot-Plug controllers (one per segment).
Advanced platform RAS
  • Features such as memory Error Correction Code (ECC), Intel® x4 Single Device Data Correction (x4 SDDC)2, DIMM sparring, DIMM scrubbing and memory mirroring can improve system reliability.
  • 32-bit CRC on PCI Express*.
  • SMBus port hooks into Intel® E7520 and Intel® E7320 chipsets for remote management operation and support for variety of third-party Base Management Controller (BMC) and BIOS solutions.
Intel® Hub Interface 1.5 connection to the MCH chipset Point-to-point connection between the MCH chipset and the Intel® 82801ER I/O controller hub or Intel® 6300ESB I/O controller hub devices provides 266 MB/s of bandwidth.


Related products

Processors
Chipsets Intel® E7520 and E7320 Chipsets


Packaging information

Intel® E7525 Memory Controller Hub (MCH) chipset 1077 Flip Chip-Ball Grid Array (FC-BGA)
Intel® 6700PXH 64-bit PCI Hub 567 Flip Chip-Ball Grid Array (FC-BGA)
Intel® 82801ER (ICH5R) 460 Micro Ball Grid Array (µBGA)
Intel® 6300ESB I/O Controller Hub 689 Plastic Ball Grid Array (PBGA)

1 PCI Express* reduced power-state "L0s" is not supported.

2 In an x4 DDR memory device, the Intel® x4 Single Device Data Correction (x4 SDDC) provides error detection and correction for 1, 2, 3 or 4 data bits within that single device and provides error detection, up to 8 data bits, within two devices.

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