FEATURES AND BENEFITS
- With up to 8 cores and 16 threads per socket with Intel® Hyper-Threading Technology (Intel® HT Technology),◊ the Intel® Xeon® processor 7500 series offers increased performance with 45nm manufacturing technology and increased headroom for multi-threaded applications and data-demanding applications.
- Intel® microarchitecture code name Nehalem with 45nm hi-k process technology enables larger on-die cache boosting performance on multiple applications/user environments and data-demanding workloads, while enabling denser data center deployments and reduced transistor gate leakage for greater energy efficiency.
- 18 MB of L3 cache increases efficiency of cache-to-core data transfers, maximizing main memory to processor bandwidth.
- Intel® QuickPath Interconnect (Intel® QPI) provides high-speed (up to 25.6 GB/s), point-to-point connections between processors, as well as between processors and the I/O hub.
SPECIFICATIONS
Intel® Xeon® Processor 6000 Sequence
Click on processor number to see detailed specifications and block diagrams.
TECHNICAL DOCUMENTS
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Application Notes
- AP-485 Intel® Processor Identification and CPUID Instruction [pdf]
This application note explains how to use the CPUID instruction in software applications, BIOS implementations, and various processor tools. By taking advantage of the CPUID instruction, software developers can create software applications and tools that can execute compatibly across the widest range of Intel processor generations and models, past, present, and future. - Intel® Socket Test Technology for LGA771 [pdf]
Intel® Socket Test Technology for LGA771 has been developed to provide solder-joint and pin contact coverage for LGA771 sockets that have been assembled onto motherboards. This integrated silicon technology dramatically improves coverage (up to 90%), and enables motherboard makers to improve overall product quality and assembly process performance. This document includes the theory on which Intel® Socket Test Technology is based, typical test methods, and device specifications.
- AP-485 Intel® Processor Identification and CPUID Instruction [pdf]
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Datasheets
- Intel® Xeon® Processor 7000 Series Datasheet [pdf]
This document describes electrical, mechanical, and thermal specifications of the Intel® Xeon® processor 7000 series product, designed for high-performance multiprocessor server and workstation applications. - Intel® Xeon® Processor 7100 Series Datasheet [pdf]
This document describes electrical, mechanical, and thermal specifications of the Intel® Xeon® processor 7100 series product, designed for high-performance multiprocessor server and workstation applications. - Intel® Xeon® Processor 7200 Series and Intel® Xeon® Processor 7300 Series Datasheet [pdf]
- Intel® Xeon® Processor 7400 Series Datasheet [pdf]
- Intel® Xeon® Processor 7500 Series Datasheet, Volume 1 [pdf]
This document specifies processor electrical, package mechanical, thermal, signal quality, and debug tools specifications. This document includes power features, pin information, and design considerations. - Intel® Xeon® Processor 7500 Series Datasheet, Volume 2 [pdf]
This document specifies the functionality of the processor, including signals, registers, and functional descriptions. - Intel® Xeon® Processor MP with 1MB L2 Cache Datasheet [pdf]
- Intel® Xeon® Processor MP with up to 8MB L3 Cache Datasheet [pdf]
- Intel® Xeon® Processor with 2MB L2 Cache Datasheet [pdf]
- Intel® Xeon® Processor 7000 Series Datasheet [pdf]
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Design Guides
- Intel® Xeon® Processor 7000 Sequence Thermal/Mechanical Guidelines [pdf]
This document discusses thermal management and measurement techniques for the Intel® Xeon® processor 7000 sequence. The physical dimensions and power numbers used in this document are for reference only. Please refer to the Intel® Xeon® Processor 7000 Sequence Datasheet for the product dimensions, thermal power dissipation, and maximum case temperature. In case of conflict, the data in the datasheet supersedes any data in this document. - Intel® Xeon® Processor 7100 Series Thermal/Mechanical Design Guidelines [pdf]
This document discusses thermal management and measurement techniques for the Intel® Xeon® processor 7100 series. The physical dimensions and power numbers used in this document are for reference only. Please refer to the Intel® Xeon® Processor 7100 Series Datasheet for the product dimensions, thermal power dissipation, and maximum case temperature. In case of conflict, the data in the datasheet supersedes any data in this document. - Intel® Xeon® Processor 7200 Series and Intel® Xeon® Processor 7300 Series Thermal/Mechanical Design Guidelines [pdf]
- Intel® Xeon® Processor 7400 Series Thermal/Mechanical Design Guidelines [pdf]
- Intel® Xeon® Processor 7500 Series Thermal Mechanical Design Guide [pdf]
This guide contains system and processor thermal design considerations and recommendations to aid system designers in the proper implementation of thermal management. - Intel® Xeon® Processor 7500 Series Uncore Programming Guide [pdf]
- Voltage Regulator Module (VRM) and Enterprise Voltage Regulator-Down (EVRD) 11.1 Design Guidelines [pdf]
- mPGA604 Socket Design Guide [pdf]
This document provides functional, quality, reliability, and material requirements and design guidelines for the 604-pin socket used with Intel® Xeon® processors.
- Intel® Xeon® Processor 7000 Sequence Thermal/Mechanical Guidelines [pdf]
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Manuals
- Intel® 64 Architecture x2APIC Specification [pdf]
- Intel® 64 and IA-32 Architectures Optimization Reference Manual [pdf]
Intel® 64 and IA-32 Architectures Optimization Reference Manual provides information on Intel® Core™ processors, Intel NetBurst® microarchitecture, and other recent Intel® microarchitectures. - Intel® 64 and IA-32 Architectures Software Developer's Manual Documentation Changes [pdf]
This document is an update to the specifications in the Intel® 64 and IA-32 Architectures Software Developer's Manual documents. This document is a compilation of documentation changes. It is intended for hardware system manufacturers and software developers of applications, operating systems, or tools. - Intel® 64 and IA-32 Architectures Software Developer's Manual Volume 1: Basic Architecture [pdf]
Describes the architecture and programming environment of processors supporting IA-32 and Intel® 64 architectures. - Intel® 64 and IA-32 Architectures Software Developer's Manual Volume 2A: Instruction Set Reference, A-M [pdf]
Describes the format of the instruction and provides reference pages for instructions (from A to M). This volume also contains the table of contents for both Volumes 2A and 2B. - Intel® 64 and IA-32 Architectures Software Developer's Manual Volume 2B: Instruction Set Reference, N-Z [pdf]
Provides reference pages for instructions (from N to Z). VMX instructions are treated in a separate chapter. This volume also contains the appendices and index support for Volumes 2A and 2B. - Intel® 64 and IA-32 Architectures Software Developer's Manual Volume 3A: System Programming Guide, Part 1 [pdf]
Describes the operating-system support environment of an IA-32 and Intel® 64 architectures, including: memory management, protection, task management, interrupt and exception handling, multi-processor support, and thermal and power management features. This volume also contains the table of contents for both Volumes 3A and 3B. - Intel® 64 and IA-32 Architectures Software Developer's Manual Volume 3B: System Programming Guide, Part 2 [pdf]
Continues the coverage on system programming subjects begun in Volume 3A. Volume 3B covers debugging, performance monitoring, system management mode, and Intel® Virtualization Technology (Intel® VT). This volume also contains the appendices and indexing support for Volumes 3A and 3B.
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Packaging Information
- Chapter 01: Introduction [pdf]
- Chapter 02: Package/Module/PC Card Outlines and Dimensions [pdf]
- Chapter 03: Alumina and Leaded Molded Technology [pdf]
- Chapter 04: Performance Characteristics of IC Packages [pdf]
- Chapter 05: Physical Constants of IC Package Materials [pdf]
- Chapter 06: ESD/EOS [pdf]
- Chapter 07: Leaded Surface Mount Technology (SMT) [pdf]
- Chapter 08: Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs [pdf]
- Chapter 09: SMT Board Assembly Process Recommendations [pdf]
- Chapter 10: Shipping and Transport Media [pdf]
- Chapter 11: International Packaging Specifications [pdf]
- Chapter 12: Tape Carrier Package [pdf]
- Chapter 13: Pinned Packaging [pdf]
- Chapter 14: Ball Grid Array (BGA) Packaging [pdf]
- Chapter 15: The Chip Scale Package (CSP) [pdf]
- Chapter 16: Cartridge Packaging [pdf]
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Product Briefs
- Intel® Xeon® Processor 7000 Sequence Platform Brief [pdf]
The latest generation of platforms based on Intel® Xeon® processors brings an exciting new era of performance, reliability, and value for multi-processor servers. - Intel® Xeon® Processor 7000 Sequence Product Brief [pdf]
Increase MP performance with platforms based on the Intel® Xeon® processor 7000 sequence. - Intel® Xeon® Processor 7100 Series Product Brief [pdf]
When combined with the Intel® E8501 chipset and DDR2-400 memory, the scalable performance of the Intel® Xeon® processor 7100 series and enhanced reliability features of the chipset and memory create the ideal MP platform for enterprise workloads and virtualization. - Intel® Xeon® Processor 7300 Series Product Brief [pdf]
- Intel® Xeon® Processor 7400 Series Product Brief [pdf]
- Intel® Xeon® Processor 7500 Series Product Brief [pdf]
- Intel® Xeon® Processor 7000 Sequence Platform Brief [pdf]
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Specification Updates
- Intel® Xeon® Processor 7000 Series Specification Update [pdf]
- Intel® Xeon® Processor 7100 Series Specification Update [pdf]
This document is a compilation of errata, specification clarifications and changes. It is intended for hardware system manufacturers and software developers of applications, operating systems, and tools. - Intel® Xeon® Processor 7200 Series and Intel® Xeon® Processor 7300 Series Specification Update [pdf]
- Intel® Xeon® Processor 7400 Series Specification Update [pdf]
- Intel® Xeon® Processor 7500 Series Specification Update [pdf]
The specification update contains revised information about products including identification information, specification changes and clarifications, documentation changes, and errata with reference to the original specifications document. - Intel® Xeon® Processor MP with 1MB L2 Cache Specification Update [pdf]
- Intel® Xeon® Processor MP with up to 8MB L3 Cache [pdf]
- Intel® Xeon® Processor with 800 MHz System Bus (1 MB and 2 MB L2 Cache Versions) Specification Update [pdf]
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White Papers
- Building Cutting-Edge Server Applications for the Intel® Xeon® Processor Family [pdf]
The Intel® Xeon® processor family features highly scalable performance, powered by the Intel NetBurst® microarchitecture with Hyper-Threading Technology. These technologies allow server applications to support more features, increase transaction throughput and response times, and serve more concurrent users. - Increasing Data Center Density While Driving Down Power and Cooling Costs [pdf]
It takes a comprehensive strategy to scale data center capabilities, while simultaneously containing power and cooling costs. New Intel® Xeon® processor-based servers provide a critical new resource, by delivering leading performance, price/performance, and energy-efficiency for a broad range of business applications. - Solving Power and Cooling Challenges for High Performance Computing [pdf]
It takes a comprehensive strategy to scale high performance computing (HPC) capabilities, while simultaneously containing power and cooling costs. New Intel® Xeon® and Intel® Itanium® processor-based servers offer a critical new resource, delivering dramatic increases in performance, price/performance, and energy-efficiency across a broad range of HPC applications. - The New Economics of Mission-Critical Computing: Microsoft Windows Server* 2008 R2 and Intel® Xeon® Processor 7500 Series-based Servers Offer Compelling New Reasons for UNIX*/RISC Replacement [pdf]
- Building Cutting-Edge Server Applications for the Intel® Xeon® Processor Family [pdf]
TOOLS AND SOFTWARE
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Boundary scan description language (BSDL) models
- Intel® Xeon® Processor 7000 Series Boundary Scan Description Language (BSDL) Model (V2.0) [zip]
- Intel® Xeon® Processor 7100 Series Boundary Scan Description Language (BSDL) Model [zip]
- Intel® Xeon® Processor 7200 Series and Intel® Xeon® Processor 7300 Series BSDL [zip]
- Intel® Xeon® Processor 7400 Series BSDL [zip]
- Intel® Xeon® Processor 7500 Series BSDL [zip]
This set contains the appropriate files to be used for any of 4-core, 6-core, and 8-core Intel® Xeon® processor 7500 series processor. The changes to this release include updated stepping id codes, and a correction to the pin mappings to match that of the Intel® Xeon® Processor 7500 Series Datasheet, Volume 1.
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Technical books
- The Software Vectorization Handbook
The Software Vectorization Handbook provides a detailed overview of compiler optimizations that convert sequential code into a form that best exploits multimedia extensions. - The Software Optimization Cookbook, Second Edition
Get the most out of Intel IA-32 platforms with EM64T and multi-core processing. The Software Optimization Cookbook, Second Edition, provides updated recipes for high-performance applications on Intel® platforms.
- The Software Vectorization Handbook
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Thermal, mechanical, and component models
- Intel® Xeon® Processor 7100 Series Thermal Test Vehicle and Cooling Solution Thermal Models [zip]
- Intel® Xeon® Processor 7200 Series and Intel® Xeon® Processor 7300 Series Common Enabling Kit Mechanical Models (IGES* format) [zip]
- Intel® Xeon® Processor 7200 Series and Intel® Xeon® Processor 7300 Series Common Enabling Kit Mechanical Models (ProE* format) [zip]
- Intel® Xeon® Processor 7200 Series and Intel® Xeon® Processor 7300 Series Common Enabling Kit Thermal Models (in Flotherm* and Icepak* formats) [zip]
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