The Mobile Intel® 915GM Express chipset is a component of the Intel® Centrino® processor technology. Featuring the Intel® Graphics Media Accelerator 900, the 915GM chipset enables 2x the graphics performance of the previous generation of platforms based on the Intel® 855GME chipset. The Mobile Intel® 915GM Express chipset also supports Intel® High Definition Audio (Intel® HD Audio)◊ which is a new enhanced audio specification for high quality audio enabling a premium home theater experience. Additionally Mobile Intel® 915GM Express chipset supports up to 2 GB of DDR2 system memory which enables up to 60% increase in peak memory bandwidth and power benefits over DDR memory and PCI Express* bus architecture, a highly scalable general purpose I/O for the latest industry peripherals like ExpressCard*.
Product information
Features and benefits
| 533 MHz Front Side Bus |
Up to 33% increase in Front Side Bus bandwidth over the previous generation. |
| Support for dual channel
DDR2 400/533 MHz memory technology |
Up to 60% improvement in peak memory bandwidth and average power savings over
DDR memory. |
| Dual independent display |
View two independent video sources when an external monitor or panel is connected to the laptop. |
| Intel® Stable Image Technology |
Supports a unified graphics driver. Enables hardware changes without impact to IT software image stability. |
| Serial ATA |
Provides up to 150 MB/Sec transfer rate for disk traffic. |
| Direct Media Interface (DMI) |
With up to 2 GB/sec concurrent bandwidth, DMI provides up to 4 times faster I/O bandwidth compared to previous Intel proprietary Hub link I/O interface. |
| Integrated high speed
USB 2.0 |
Support for eight USB 2.0 peripherals for maximum 40x faster data transfer and backward compatible to support USB 1.1 devices. |
|
Intel® Graphics Media Accelerator (GMA) 900
|
Delivers a 2 times improvement in graphics performance over the previous generation chipset, the Intel® 855GME. Also supports Microsoft DirectX* 9 solution for high definition media playback and 3D games. |
|
Intel® High Definition Audio (Intel® HD Audio)◊ |
New audio specification enables increased bandwidth for high quality audio and support for Dolby* Technologies. Also enables power savings during audio activity. |
| Integrated TV out |
Provides board space and cost savings by eliminating the need for additional discrete chips. |
|
PCI Express* Bus Architecture |
Enables the next generation of discrete graphics and I/O. Delivers up to a 4 times increase in discrete graphics bandwidth and 2 times the I/O bandwidth. Also supports the latest industry peripherals like ExpressCard*. Low pin count offers maximum bandwidth per pin. |
Related products
Packaging information
| 82915GM (MCH) |
37.5 mm x 40 mm Micro-FCBGA |
| 82801FBM (ICH6-M) |
31 mm x 31 mm 609 pin mBGA |
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