| Pb Package Designators |
Pb-Free Package Designator |
Package Description |
Package Abbreviations |
| A |
A |
Ceramic Pin Grid Array |
PGA |
| KU |
QU |
Plastic Quad Flatpack |
PQFP |
| R |
R |
Ceramic Leadless Chip Carrier |
LCC |
| NG |
NT |
Plastic Quad Flatpack |
PQFP |
| S |
EG |
Quad Flatpack |
(QFP-EIAJ) |
| SB |
YW |
Shrink Quad Flatpack |
SQFP-EIAJ |
| FA |
JA |
Thin Quad Flatpack |
TQFP |
| FC |
UG |
Shrink Quad Flatpack with Heat Spreader |
PQ2 |
| GD |
WL |
Plastic Ball Grid Array |
PBGA |
| FW |
PR |
Plastic Ball Grid Array |
PBGA |
| U |
QT |
Shrink Dual in line package |
SDIP |
| N |
EE |
Plastic Lead Chip Carrier |
PLCC |
| P |
UJ |
Plastic Dual in-line package |
PDIP |
| TN |
EN |
Plastic Lead Chip Carrier-Extended Temp |
PLCC |
| TP |
EJ |
Plastic Dual in-line package-Extended Temp |
PDIP |
| TA |
TA |
Ceramic Pin Grid Array-Extended Temp |
PGA |
| TS |
ES |
Quad Flatpack-Extended Temp |
(QFP-EIAJ) |
| TG |
ET |
Plastic Quad Flatpack-Extended Temp |
PQFP |
Temperature Ranges:
| Commercial |
0 to +70° C |
| Extended |
-40 to +85° C |
| Automotive |
-40 to +125° C |
|
