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Intel® E8870 ChipsetFeaturing the E8870SP Component

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The Intel® E8870 chipset, featuring the E8870SP component, builds upon its single-node platform predecessor and allows for multi-node configurations of up to eight Intel® Itanium® processors. This added processor and I/O headroom is essential to systems used for large databases, business intelligence, Enterprise Resource Planning (ERP) and other high-end, heavy-load applications. The highly reliable and serviceable building-block architecture of the E8870 chipset provides excellent return on investment, allowing the system to grow with your business needs.

Product information

Features and benefits

Balanced chipset architectureDelivers optimal system performance through well-aligned bandwidths (system bus, memory, SP and I/O bandwidths are well balanced).
Support for multiple Intel® Itanium® processor family generationsPlatform longevity.
Data Error Correction Code (ECC) protection across key interfacesProvides enterprise-class data integrity across multiple nodes.
Built-in central snoop filter architecture of the E8870SPPreserves coherency while minimizing snoops to remote nodes.
400 MHz, 128-bit system bus capability6.4 GB/s system bus supports up to 4 Intel® Itanium® processors for optimal system performance.
High memory capacityThe DDR Memory Hub (DMH) provides a maximum of 8 DIMM slots with an aggregate of 32 memory slots enabled per processor node. Maximum capacity supported per processor node is 128 GB using 4 GB DIMMs.
Two high bandwidth scalability ports per SNC and SIOHProvides sufficient system headroom for single-node, multiple-node and degraded configurations.
Hub interface 2.0 connectivityDelivers 1 GB/sec bandwidth per connection, providing multiple I/O configuration options and offering both flexibility and performance.
I/O pre-fetch engine and built-in cacheDelivers full bandwidth on data return.
High-performance PCI/PCI-X bridge supportProvides support to all PCI/PCI-X I/O devices, from legacy PCI to higher performance PCI-X at 133 MHz.
Advanced platform RASUMECC protection and correction, memory scrubbing, Memory Device Failure Recovery (MDFR), multiple redundant I/O paths and error logging combine to yield a more reliable platform. This reduces downtime for repair and ensures data integrity across all interconnects and busses.


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