Intel® 845MP/845MZ ChipsetOverview
The Intel® 845MP and Intel® 845MZ chipsets are designed, validated and optimized for the Mobile Intel® Pentium® 4 Processor - M. The Intel® 845MP Chipset supports external graphics and Intel® 845MZ Chipset is optimized for value systems. These platforms deliver the benefits of Intel® quality, reliability and stability that businesses need to deploy mobile computers with maximum ROI and performance headroom for the future. The ICH3-M (82801 CAM I/O Controller Hub 3) makes a direct connection to 845MP/MZ for smoother and faster access to peripherals, providing more benefit for extended PC usage models. Additionally, the chipset uses Intel's advanced mBGA packaging and supports 6 USB ports.
Features and benefits
| 400MHz System Bus | Delivers a high-bandwidth connection between the Mobile Intel® Pentium® 4 processor - M and the platform |
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| Intel® I/O Hub architecture | Provides a high bandwidth (266MB/s) I/O pipe that delivers fast communications and reduces latency time for I/O operations. |
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| DDR 200/266 MHz SDRAM | Choice of memory technology to support a full range of price/performance requirements up to 1GB. DDR memory offers high reliability and consumes minimal power, critical to the mobile PC platform |
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| AGP4X interface | Provide the most advanced graphics support available, enabling over 1 GB/s of graphics bandwidth interface for high-quality 2D, 3D, and video streams |
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| Enhanced Intel Speedstep® Technology | Real-time dynamic switching of voltage and frequency between maximum performance and battery-optimized operation, based on CPU demand, for longer battery life |
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| Deeper Sleep Alert State | New dynamic power management mode operates at 66% lower voltage than Deep sleep mode for longer battery life |
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| Advanced Power Management | Supports ACPI 2.0 compliant for the latest power management and legacy power management with APM 1.2 compliant. |
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| Ultra ATA/100 | Takes advantage of the latest industry innovations in HDD features and performance |
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| Latest AC97 Controller | Excellent audio quality, with up to six channels for full surround sound capability including a simultaneous modem connection |
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| Thin & Small Package Technology | Intel® 845MP/MZ chipset uses Intel's most advanced Flip-Chip Ball Grid Array (FCBGA) packaging that is excellent for reducing package size and improves the chipset cooling capability. |
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Related products
| Products | |
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| Other Products | - 82845MP/MZ Memory Controller Hub
- 82801 CAM I/O Controller Hub 3
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