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Valluri Rao
Intel Fellow, Technology and Manufacturing Group
Director, Analytical and Microsystems Technology
INTEL CORPORATION
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 | 6,848,177, An Integrated Circuit Die And An Electronic Assembly Having A Three-Dimensional Interconnection Scheme, N/A |
 | 4,766,372, Electron Beam Tester, 8/23/1988 |
 | 6,084,396, Method For Performing Quantitative Measurement Of Dc And Ac Current Flow In Integrated Circuit Interconnects By The Measurement Of Magnetic Fields With A Magneto Optic Laser Probe, 7/4/2000 |
 | 5,969,517, Apparatus For Performing Quantitative Measurement Of Dc And Ac Current Flow In Integrated Circuit Interconnects By Measurement Of Magnetic Fields With A Magneto Optic Laser Probe |
 | 5,952,247, Method Of Accessing The Circuitry On A Semiconductor Substrate From The Bottom Of The Semiconductor Substrate, 9/14/1999 |
 | 6,122,174, A Method Of Accessing The Circuitry On A Semiconductor Substrate From The Bottom Of The Semiconductor Substrate, 9/19/2000 |
 | 5,805,421, Semiconductor Substrate Having Alignment Marks For Locating Circuitry On The Substrate, 9/8/1998 |
 | 5,872,360, Method And Apparatus Using An Infrared Laser Based Optical Probe For Measuring Electric Fields Directly From Active Regions In An Integrated Circuit, 2/16/1999 |
 | 6,072,179, Method And Apparatus Using An Infrared Laser Based Optical Probe For Measuring Voltages Directly From Active Regions In An Integrated Circuit, 6/6/2000 |
 | 5,812,708, Method And Apparatus For Distributing An Optical Clock In An Integrated Circuit, 9/22/1998 |
 | 5,889,903, Method And Apparatus For Distributing An Optical Clock In An Integrated Circuit, 3/30/1999 |
 | 5,904,486, Method For Performing A Circuit Edit Through The Back Side Of An Integrated Circuit Die, 5/18/1999 |
 | 6,150,718, Method And Apparatus For Performing A Circuit Edit Through The Back Side Of An Integrated Circuit Die |
 | 6,037,822, Method And Apparatus For Distributing A Clock On The Silicon Backside Of An Integrated Circuit, 3/14/2000 |
 | 6,316,981, Signal Distribution Network On Backside Of Substrate |
 | 6,448,168, Method And Apparatus For Distributing A Clock On The Silicon Backside Of An Integrated Circuit, 9/10/2002 |
 | 5,976,980, Method And Apparatus Providing A Mechanical Probe Structure In An Integrated Circuit Die, 11/2/1999 |
 | 6,049,639, Method And Apparatus Providing Optical Input/Output Through The Back Side Of An Integrated Circuit Die, 4/11/2000 |
 | 6,075,908, Method And Apparatus For Optically Modulating Light Through The Back Side Of An Integrated Circuit Die, 6/13/2000 |
 | 6,222,246, Flip-Chip Having An On-Chip Decoupling Capacitor, 4/24/2001 |
 | 6,393,169, Method And Apparatus For Providing Optical Interconnection, 5/21/2002 |
 | 6,587,605, Method And Apparatus For Providing Optical Interconnection, 7/1/2003 |
 | 6,125,217, Clock Distribution Network, 9/26/2000 |
 | 6,355,950, Substrate Interconnect For Power Distribution On Integrated Circuits, 3/12/2002 |
 | 6,495,454, Substrate Interconnect For Power Distribution On Integrated Circuits |
 | 6,753,541, Method And Apparatus For Making And Using A Beacon Fiducial For An Integrated Circuit, 6/22/2004 |
 | 6,621,137, Mems Device Integrated Chip Package, And Method Of Making Same, 9/16/2003 |
 | 6,593,672, Mems-Switched Stepped Variable Capacitor And Method Of Making Same, 7/15/2003 |
 | 6,753,639, Micro-Electromechanical Structure Resonator Frequency Adjustment Using Radiant Energy Trimming And Laser/Focused Ion Beam Assisted Deposition, 6/22/2004 |
 | 6,573,822, Tunable Inductor Using Microelectromechanical Switches, 6/3/2003 |
 | 6,650,204, Resonator Frequency Correction By Modifying Support Structures |
 | 6,570,468, Resonator Frequency Correction By Modifying Support Structures, 5/27/2003 |
 | 6,808,954, Vacuum-Cavity Mems Resonator |
 | 6,852,492, Nucleic Acid Sequencing By Raman Monitoring Of Uptake Of Precursors During Molecular Replication, 2/8/2005 |
 | 6,822,535, Film Bulk Acoustic Resonator Structure And Method Of Making |
 | 6,662,419, Method For Fabricating Film Bulk Acoustic Resonators To Achieve High-Q And Low Loss |
 | 6,686,820, Microelectromechanical (Mems) Switching Apparatus, 2/3/2004 |
 | 6,812,814, Microelectromechanical (Mems) Switching Apparatus, 11/2/2004 |
 | 6,621,022, Reliable Opposing Contact Structure, 9/16/2003 |
 | 6,706,981, Techniques To Fabricate A Reliable Opposing Contact Structure, 3/16/2004 |
 | 6,848,177, An Integrated Circuit Die And An Electronic Assembly Having A Three-Dimensional Interconnection Scheme, 2/1/2005 |
 | 6,673,697, Packaging Microelectromechanical Structures, 1/6/2004 |
 | 6,852,926, Packaging Microelectromechanical Structures, 2/8/2005 |
 | 6,816,035, Forming Film Bulk Acoustic Resonator Filters, 11/9/2004 |
 | 6,713,314, Hermetically Packaging A Microelectromechanical Switch And A Film Bulk Acoustic Resonator, 3/30/2004 |
 | 6,787,970, Tuning Of Packaged Film Bulk Acoustic Resonator Filters, 9/7/2004 |
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