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Intel And HP To Accelerate The Adoption Of Standards-Based Modular Telecommunications SolutionsIntel Names HP as the First Premier Member of Intel® Communications AllianceSUPERCOMM, ATLANTA, June 3, 2003 -Intel Corporation and Hewlett-Packard Company (NYSE: HPQ) are working together to develop standards-based communications solutions that will help telecommunication equipment manufacturers (TEMs) reduce development costs and speed time-to-market for new products, and enable carriers and service providers to quickly launch new revenue-generating services. The products and solutions expected to result from this collaboration will feature Intel® Itanium® processors, embedded Intel Architecture processors and other silicon from Intel. HP plans to offer solutions based on Rack Mount Servers (RMS) and the Advanced Telecom Computing Architecture* (AdvancedTCA) specification. These products and solutions are designed to enable TEMs to effectively consolidate their platform designs around a re-usable, flexible and interoperable platform that is optimized for wireless and wire line network infrastructure as well as enterprise network edge applications. As announced today, HP plans to deliver its high-performance, Intel-based cc3310 rack mount server to TEMs and carriers in the third quarter. Intel has also named HP as the first premier member of the Intel Communications Alliance (ICA). The ICA is a community of communications and embedded developers and solutions providers who share a common vision on the transition to standards-based modular platforms. At SUPERCOMM, Intel is announcing the first roll-out of Alliance members from around the world, including HP at the premier level and 40 others at the associate and affiliate levels of membership. Alliance members are aligned around the development of modular, standards-based building blocks, platforms and solutions, resulting in an architecturally aligned supply line based on Intel processors, board-level products and services. "Telecommunications equipment manufacturers and carriers realize the value of transitioning to modular systems based on cost efficient, off-the-shelf, interoperable and re-usable hardware and software building blocks," said Howard Bubb, vice president and general manager, Intel Network Processing Group. "The use of silicon, software and platform modular building blocks from Intel and other members of the Intel Communications Alliance helps TEMs and carriers reduce costs, improve performance and speed time-to-market for new products and revenue-generating services." "For 25 years, HP has helped equipment manufacturers and operators build fixed and mobile infrastructure, and we have encouraged the trend toward standards-based technologies," said Sebastiano Tevarotto, vice president and general manager, HP Network and Service Provider Business Unit. "With Intel, we are cooperating to deliver carrier-grade platforms that we expect to significantly raise the price-performance bar in the industry. We enthusiastically support the Intel Communications Alliance." With decades of experience in the telecommunications and service provider industry, HP offers a broad array of network-based technologies, solutions and professional services. HP and its 500 solutions partners provide network equipment and service providers with infrastructure for fixed and wireless networks, network services, operations and business support systems, mobile and rich media solutions, and end-user access. About HP About the Intel Communications Alliance Intel and Itanium are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. * Other names and brands may be claimed as the property of others. |
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