Embedded platforms based on validated combinations of Intel® Xeon® processors and chipsets provide:

  • Highest available processing performance
  • Dual-processor configurations for ultimate multi-core computing and very high compute density
  • Memory reliability, availability and serviceability (RAS)
  • NEBS compatibility
  • Intel® product technologies for hardware-based manageability, proactive security, flexible virtualization and intelligent power management
INTEL® XEON® PROCESSORS
  • Architectural Migration Guides

Guidelines for migrating from other processor architectures

  • Technical Content

Technical library white papers, briefs and other resources

  • Special Offers

Learn about Intel’s Evaluation Platform Programs and other special offers

EXPLORE INTEL® XEON® PROCESSORS

Match the features and capabilities of the latest Intel® products to the requirements of your embedded design. Learn where to find relevant technical content, hardware test tool loans, development software, training and other available resources.

RELEASE DATEPERFORMANCE¹POWERFOOTPRINT
Intel® Xeon® Processor 5600/5500 Series with the Intel® 5520 ChipsetFormerly Tylersburg / Westmere-EP
Q2 2010 69.6 - 191.6 W Platform Power 4279.5 - 6192 mm² (3-4 chips) Footprint

With performance and virtualization for communications and storage, the Intel® Xeon® processor 5600 series are the first Intel® Xeon® processors based on 32nm technology.

Intel® Xeon® Processor C5500/C3500 Series with Intel® 3420 ChipsetFormerly Picket Post
Q1 2010 27.7 - 89.7 W Platform Power 2588 - 4500 mm² (2-3 chips) Footprint

Excellent scalability with single- to quad-core options, increased processor performance/watt with integrated I/O hub functions, and features designed for embedded and storage applications.

Intel® Core™ i5, Core™ i3, Intel® Pentium®, Intel® Xeon® Processors with Intel® 3450 ChipsetFormerly Foxhollow
Q1 2010 77.7 - 97.7 W Platform Power 2135.25 mm² (2 chips) Footprint

32nm (Clarkdale) and 45nm (Lynnfield) processors with ECC, 2 chip solution: dual- and quad-core platforms fit a wide range of performance-intensive, low-power embedded applications in smaller form factors.

Intel® Xeon® Processor 5000/3000 Series with the Intel® 5100 ChipsetFormerly Cranberry Lake
Q1 2008 60 - 190 W Platform Power 5409 mm² (3-4 chips) Footprint

Breakthrough performance for bladed and dense bladed applications requiring less than 200W, including ATCA* and NEBS-compliant solutions.

Intel® Xeon®, 2nd Generation Intel® Core™, Intel® Pentium® and Intel® Celeron® Processors with Intel® C206 ChipsetFormerly Bromolow
Q2 2011 71.1 - 101.1 W Platform Power 2031.25 mm² (2 chips) Footprint

This platform based on Intel® microarchitecture, codename Sandy Bridge, delivers accelerated compute performance, enhanced media and graphics, and improved security capabilities.

Intel® Xeon® Processor E5-2600 and E5-2400 Series with Intel® C604/C602-J ChipsetFormerly Romley
Q1 2012 57.8 - 102.8 W Platform Power 3091.5 mm² (2 chips) Footprint

First embedded Intel® Xeon® processor to offer 8-core/single socket to 16-core/two socket solutions providing significant performance improvement from previous generations.

Intel® Xeon® Processor E3-1200v2 Series with Intel® C216 ChipsetFormerly Carlow
Q2 2012 101.7 W Platform Power 2031.25 mm² (2 chips) Footprint

Manufactured on 22nm process technology with 3D Tri-Gate transistors, these processors delivers quad-core processing and intelligent performance capabilities with enhanced media and graphics.

+ Product and Performance Data

¹Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of Intel products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. Buyers should consult other sources of information to evaluate the performance of systems or components they are considering purchasing. For more information on performance tests and on the performance of Intel products, please visit http://www.intel.com/performance/resources/benchmark_limitations.htm

²TDP values for Intel® Atom™ Processor E6xx Series are pre-silicon estimates.

SPEC* CPU2006 is an industrial standard benchmark designed to provide performance measurements that can be used to compare compute-intensive workloads on different computer systems. SPEC* CPU2006 test on Intel microprocessors are measured using particular, well-configured systems. These results may or may not reflect the relative performance of Intel microprocessor in systems with different hardware or software designs or configurations (including compilers). Buyers should consult other sources of information, including system benchmarks to evaluate the performance of systems they are considering purchasing. For more information about SPEC* CPU2006 please visit www.spec.org/cpu2006/

For the description of the systems used to obtain these test result, and other information about microprocessor and system performance and benchmarks, visit Intel's World Wide Web Site (www.intel.com), or call 1-800-628-8686.

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