Embedded platforms based on validated combinations, Intel® Core™ processors and chipsets provide:

  • New levels of performance enable FLOPS demanding applications with Intel® Advanced Vector Extension (AVX) Technology
  • Visually stunning use cases through cutting edge 3D graphics, video, and display
  • Processor, graphics and memory controller on same die for maximum efficiency in board space and power consumption
  • Built–in intelligence to manage demanding workloads
  • Power efficiency allows systems to do more with similar thermal solutions
  • Intel® vPro™ technology for remote manageability and security
  • Error correcting code (ECC) memory for data integrity
INTEL® CORE™ PROCESSORS
  • Architectural Migration Guides

Guidelines for migrating from other processor architectures

  • Technical Content

Technical library white papers, briefs and other resources

  • Special Offers

Learn about Intel’s Evaluation Platform Programs and other special offers

  • Embedded Hardware Test Tool Loan Program
  • Evaluation Platforms
  • Technical Knowledge by MindShare*

EXPLORE INTEL® CORE™ PROCESSORS

Match the features and capabilities of the latest Intel® products to the requirements of your embedded design. Learn where to find relevant technical content, hardware test tool loans, development software, training and other available resources.

RELEASE DATEPERFORMANCE¹POWERFOOTPRINT
Intel® Core™ i7, Core™ i5, Core™ i3 and Celeron® Processors with Mobile Intel® QM57 and Mobile Intel® HM55 Express ChipsetFormerly Calpella / Calpella+ECC
Q1 2010 21.5 - 38.5 W Platform Power 1627 - 2081 mm² (2 chips) Footprint

32nm technology, 2 chip solution, providing excellent performance and power efficiency with impressive graphics, memory, and I/O. Support for small form factor and value apps.

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Design resources
Intel® Core™ i7, Core™ i5, Core™ i3 and Intel® Pentium® Processors with Intel® Q57 ChipsetFormerly Piketon
Q1 2010 77.7 - 97.7 W Platform Power 2135.25 mm² (2 chips) Footprint

32nm (Clarkdale) and 45nm (Lynnfield) processors, 2 chip solution: dual- and quad-core platforms fit a wide range of performance-intensive, low-power embedded applications in smaller form factors.

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Design resources
Intel® Core™2 Quad and Intel® Core™2 Duo Processor with Intel® Q45 Express ChipsetFormerly McCreary
Q3 2008 86.5 - 116.5 W Platform Power 3523 mm² (3 chips) Footprint

Dual- and quad-core platforms fit a wide range of performance-intensive, low-power embedded applications in smaller form factors.

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Design resources
Intel® Core™2 Duo, Intel® Celeron® and Intel® Celeron® M Processors with Mobile Intel® GM45, Intel® GS45, and Intel® GL40 Express ChipsetFormerly Montevina
Q3 2008 20 - 49.5 W Platform Power 1415 mm² (3 chips) Footprint

Excellent performance and power efficiency with impressive graphics, memory, and I/O. Support for small form factor and value apps.

Learn more

Design resources
2nd Generation Intel® Core™, Intel® Pentium® and Intel® Celeron® Processors with Intel® Q67/B65/H61 Express ChipsetsFormerly Sugar Bay
Q1 2011 71.1 - 101.1 W Platform Power 2135.25 mm² (2 chips) Footprint

Scalable platform based on the 2nd generation Intel® Core™ microarchitecture providing excellent performance and power efficiency with impressive processor graphics, memory and I/O.

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Design resources
2nd Generation Intel® Core™ and Intel® Celeron® processors with Mobile Intel® QM67/HM65 Express ChipsetsFormerly Embedded Huron River
Q1 2011 38.9 - 48.9 W Platform Power 2031.25 mm² (2 chips) Footprint

Low-power platform based on the 2nd generation Intel® Core™ microarchitecture providing excellent performance and power efficiency with impressive processor graphics, memory and I/O.

Learn more

Design resources
3rd Generation Intel® Core™ i7 and Core™ i5 Processors with Intel® B75 Express ChipsetFormerly Maho Bay
Q2 2012 71.7 - 83.7 W Platform Power 2135.25 mm² (2 chips) Footprint

Scalable platform based on the 3rd generation Intel® Core™ microarchitecture providing excellent performance and power efficiency with impressive processor graphics, memory and I/O.

Learn more

Design resources
3rd Generation Intel® Core™ i7 Processors with Mobile Intel® HM76 Express ChipsetFormerly Chief River
Q2 2012 39.1 - 49.1 W Platform Power 2031.25 mm² (2 chips) Footprint

Low-power platform based on the 3rd generation Intel® Core™ microarchitecture providing excellent performance and power efficiency with impressive processor graphics, memory and I/O.

Learn more

Design resources

+ Product and Performance Data

¹Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of Intel products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. Buyers should consult other sources of information to evaluate the performance of systems or components they are considering purchasing. For more information on performance tests and on the performance of Intel products, please visit http://www.intel.com/performance/resources/benchmark_limitations.htm

²TDP values for Intel® Atom™ Processor E6xx Series are pre-silicon estimates.

SPEC* CPU2006 is an industrial standard benchmark designed to provide performance measurements that can be used to compare compute-intensive workloads on different computer systems. SPEC* CPU2006 test on Intel microprocessors are measured using particular, well-configured systems. These results may or may not reflect the relative performance of Intel microprocessor in systems with different hardware or software designs or configurations (including compilers). Buyers should consult other sources of information, including system benchmarks to evaluate the performance of systems they are considering purchasing. For more information about SPEC* CPU2006 please visit www.spec.org/cpu2006/

For the description of the systems used to obtain these test result, and other information about microprocessor and system performance and benchmarks, visit Intel's World Wide Web Site (www.intel.com), or call 1-800-628-8686.

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