Process Development Engineers develop 65 nanometer and beyond semiconductor processes using state-of-the-art equipment and materials by engaging in process and equipment development activities, establishing process control systems and the manufacturability of developed processes, as well as applying proven equipment maintenance processes and monitoring procedures. Process Development Engineers work in a team environment to carry out module development and improve module performance, sustain routine operations, maintain equipment, and mentor technicians.
Components Researchers develop advanced technologies for next-generation logic. Responsibilities include advanced research and development in next-generation lithography processes and masks, alternative substrates, advanced etch/clean modules, as well as next-generation transistor and interconnect modules and processes.
Device Physics Engineers develop advanced logic technologies for microprocessors, high-performance transistors and interconnects. The position includes defining the modeling and simulation tool scope and direct involvement in the development of algorithms, models and methodologies. The development areas include plasma etching, lithography correction techniques, compact device and interconnect model development and application, as well as development of simulation and optimization capabilities. The responsibilities include software and model development, data analysis and support of external interactions.
Circuit and Logic Design Engineers design microprocessor circuits as a part of a product development team with a focus on designing new process technologies. Responsibilities include circuit and logic design, simulation, chip planning, layout supervision, validation and debug.
Test Engineers develop the test processes, methods, tools/tooling for all next generation Intel semiconductor chips (logic, memories, chipsets, and wireless devices) and are responsible for driving test requirements from product definition to ramping high volume manufacturing. Test results provide key feedback to the fabrication and assembly processes, and are used to maximize Intel yields while protecting its customers against defective or marginal devices.
Lithography Process Engineers determine the best operating settings and conditions for printing circuit patterns on the silicon
wafers. Typically hiring candidates with a Master's or PhD degree in electrical engineering, chemical engineering, material science or
computer science for this type of position, we anticipate the skill set will focus on physics, optics, and semiconductor processing
with an emphasis on optics and photo-resist technology.
Lithography Equipment Engineers install and maintain the equipment in the best operating conditions to achieve utilization update goals.
Focusing on a skill set containing electro-optical mechanics and equipment total cost of ownership (TCO), typical candidates hold a Master's
or PhD degree in electrical engineering, material science or computer science.
Lithography Technicians operate, process and perform preventive maintenance and equipment repairs to meet performance goals. Candidates
for these positions typically hold an Associate's degree with an emphasis in electronics and skills focused on electro-optical mechanics and
equipment troubleshooting and repair.