Hi, my name is Noel. I work in an area called Thin Films.
We deposit different layers onto the wafer surface, which helps us to channel and direct the electric circuit. We build conducting layers which are made of metal and non conducting layers which are make of silicon dioxide.
We use sputter tools to build conducting layers. The sputter machine showers the wafer with metal particles which build into a metal layers on the silicon surface. We use deposition tools to build the non conducting layers. Here we introduce different gases which combine together to form silicon dioxide. The wafers now move to the Planar area.
